Solid State Disk supports embedded IDE and PIO/4 interface.
November 14, 2008 -
Measuring 7.5 cm³, ruggedized Solid State Disk features 2 stacks, each containing 1, 2, or 4 NAND components, providing total bit density of 4, 8, or 16 GB. Device offers burst transfer rate of 16.67 MB/sec and sustained transfer rate of 6.7 MB/sec. Suited for harsh environments ranging from 0-70°C, disk features built-in wear leveling and MTBF of more than 2 million hours. It is intended for direct board mounting and has redundant board interconnects.
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Original Press release
Austin Semiconductor Europe, Ltd.
8701 Cross Park Dr.
Austin, TX, 78754
USA
Austin Semiconductor, Inc. Unveils a Smaller, More Compact 7.5 cm³ IDE Ruggedized Solid State Disk (SSD)
Austin Semiconductor, Inc. (ASI), a leading supplier of high reliability (HI-REL) as well as, plastic encapsulated semiconductor products and services, announces a smaller, more compact 7.5 cm3 (31mm sq x 7.8mm max height) ruggedized Solid State Disk (SSD). The newly redesigned Solid State Disk (SSD) supports an embedded IDE, PIO/4 interface, has MTBF of more than two million hours and is ideal for harsh environment operation (0-70oC operations with future -40oC to +85oC).
"Our unique SSD is designed for use in low power, ruggedized environments. The device is intended for direct board mounting and has redundant board interconnects to increase the overall product reliability, which makes it ideal for handheld applications," says Frank Muscolino, President of Austin Semiconductor.
The solid state disk is based on a proprietary package (die) stacking technology to create an extremely space conscious, robust Solid State Disk. The SSD is capable of operating in harsh, vibration prone product platforms such embedded computing applications, heavy transportation, ultra portables, handhelds, mobile computing, digital radio, high-speed networking & enterprise applications, as well as, military, aerospace and industrial applications.
FEATURES:
o SLC NAND FLASH Controller
o(2) stacks, each containing (1, 2 or 4) NAND components
o Each NAND component, either a 4,8 or 16Gb device, based on the use of single silicon and stacked silicon solutions
o Providing a total bit density of either 4,8 or 16GB
o Controller contained in base interposer
o Fast ATA host to buffer transfer rates supporting True IDE, PIO/4 mode support
o 512Byte Sector Buffers
o Flash Memory power-down logic
o ECC correction = 6 Bytes within a 512 Byte sector
o Automatic Sleep Mode
o Burst Transfer rate, 16.67MB per second
o Sustained Transfer rate: 6.7MB per second
o Built-In Wear Leveling
Austin Semiconductor, Inc. has been supplying technology solutions to the high reliability marketplace for over twenty years. Being fully QML certified and ISO 9001 / AS9100 registered, Austin Semiconductor meets and exceeds the demands of the Military, Aerospace, Transportation, Industrial-Embedded and Medical Diagnostic markets. Current product offerings include I/C components and Multi-Chip Modules, as well as, integrated product solutions to their customers through a broad line of HI-REL Ceramic products, Integrated Plastic Encapsulated Microcircuits (iPEM), Commercial-Off-The-Shelf (COTS) up-screened products and a Solid State Disk. Austin Semiconductor is located in Austin, Texas and works with their sister company, TS2 Micro in Alton, England to provide optimum products and services for the world wide high-reliability marketplace. For more information, please visit our website at www.austinsemiconductor.com.
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