Immersion Tin eliminates tin whisker formation.
August 19, 2010 -
Providing solderability for interconnect applications, Tinposit(TM) LF Immersion Tin produces uniform tin deposits on properly prepared PWB substrates and is specifically formulated for use in lead-free assembly processes. Product eliminates galvanic corrosion, preventing yield loss from circuit breaks. Deposits maintain solderability after multiple lead-free PCB assembly reflow cycles.
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|Original Press release |
Dow Chemical Co., The
2030 Dow Center
Midland, MI, 48674-0001
TinpositTM LF Immersion Tin
The latest in immersion tin technology providing high reliability and solderability for interconnect applications
Maintains excellent solderability after multiple lead-free PCB assembly reflow cycles, improving manufacturing process capability and yield;
Outstanding solder joint reliability, resulting from excellent bonding force between PCB pad and reflowed solder paste;
No tin whisker formation, increasing product reliability and avoiding short-circuits between closely spaced circuit features;
Effectively eliminates galvanic corrosion preventing yield loss from circuit breaks;
Significantly reduced attack on solder mask
Tinposit(TM) LF Immersion Tin produces uniform and solderable tin deposits on properly prepared PWB substrates and is specifically formulated to be used in lead-free
assembly processes. The deposits can maintain good solderability after multiple reflow processes. The Tinposit(TM) LF Immersion Tin bath is easy to control and has a high
tolerance for contaminants.