Product News: Materials & Material Processing
Immersion Tin eliminates tin whisker formation.
Press Release Summary:
August 19, 2010 - Providing solderability for interconnect applications, Tinposit(TM) LF Immersion Tin produces uniform tin deposits on properly prepared PWB substrates and is specifically formulated for use in lead-free assembly processes. Product eliminates galvanic corrosion, preventing yield loss from circuit breaks. Deposits maintain solderability after multiple lead-free PCB assembly reflow cycles.
Original Press Release
TinpositTM LF Immersion Tin
Press release date: August 12, 2010
The latest in immersion tin technology providing high reliability and solderability for interconnect applications
Tinposit(TM) LF Immersion Tin produces uniform and solderable tin deposits on properly prepared PWB substrates and is specifically formulated to be used in lead-free assembly processes. The deposits can maintain good solderability after multiple reflow processes. The Tinposit(TM) LF Immersion Tin bath is easy to control and has a high tolerance for contaminants.