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Immersion Tin eliminates tin whisker formation.

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August 19, 2010 - Providing solderability for interconnect applications, Tinposit(TM) LF Immersion Tin produces uniform tin deposits on properly prepared PWB substrates and is specifically formulated for use in lead-free assembly processes. Product eliminates galvanic corrosion, preventing yield loss from circuit breaks. Deposits maintain solderability after multiple lead-free PCB assembly reflow cycles.

TinpositTM LF Immersion Tin

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Dow Chemical Co., The
2030 Dow Center
Midland, MI, 48674-0001

Press release date: August 12, 2010

The latest in immersion tin technology providing high reliability and solderability for interconnect applications

  • Maintains excellent solderability after multiple lead-free PCB assembly reflow cycles, improving manufacturing process capability and yield;
  • Outstanding solder joint reliability, resulting from excellent bonding force between PCB pad and reflowed solder paste;
  • No tin whisker formation, increasing product reliability and avoiding short-circuits between closely spaced circuit features;
  • Effectively eliminates galvanic corrosion preventing yield loss from circuit breaks;
  • Significantly reduced attack on solder mask

    Tinposit(TM) LF Immersion Tin produces uniform and solderable tin deposits on properly prepared PWB substrates and is specifically formulated to be used in lead-free assembly processes. The deposits can maintain good solderability after multiple reflow processes. The Tinposit(TM) LF Immersion Tin bath is easy to control and has a high tolerance for contaminants.

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