EMI Shield snaps into place.
February 4, 2003 - Multi-cavity, board-level snapSHOTâ„¢ is made of metallized, thermoformed plastic. It installs and removes easily and accommodates intricately shaped designs. Electrically insulated on inside, shield allows for significant thickness reduction over conventional shielding. Unit is attached to PCB panel using BGA spheres. Packaged in bulk, trays, and in tape and reel, shield can be installed using manual, semi-automated, and fully automated equipment.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Gore, W. L., & Associates, Inc.
551 Paper Mill Rd.
Newark, DE, 19711
USA
Gore Launches New Board Level EMI Shielding Solutions
Elkton, Md. (January 17, 2003) W. L. Gore & Associates, Inc., a leading supplier of innovative EMI shielding solutions, launches the snapSHOTâ„¢ EMI shield, a revolutionary, board level, multi-cavity shielding product that provides excellent protection against electromagnetic interference. Gore will showcase the product in booth #622 at the upcoming Wireless Systems Design Conference & Expo to be held on February 24 - 27, 2003 in the San Jose Convention Center, San Jose, CA. The metallized, thermoformed plastic shield is easy to install, easy to remove, and accommodates intricately shaped designs. Electrically insulative on the inside, it also allows for significant thickness reduction over currently available shielding solutions.
The snapSHOTâ„¢ EMI shield is attached to the printed circuit board using Gore's patented snap attachment mechanism. Installation of the shield begins by applying BGA spheres to the PCB panel using a standard stencil printer with a special head. After the PCB has been populated and reflowed (permanently attaching the spheres), the shield is simply snapped in place. The spheres provide the electrical connection to the ground plane as well as the mechanical means for retention of the shield. Flatness of the PCB (coplanarity) is not critical for proper installation or performance of the shield. Because the installation of the shield onto the BGA spheres is not permanent, the shield may be easily removed by hand without special tooling.
The shield is manufactured from a metallized, high temperature, high performance plastic material which is extremely lightweight. Packaged in bulk, trays or in tape and reel, the shield can be easily installed using manual, semi-automated or fully automated equipment.
W. L. Gore & Associates, Inc. is a leader in providing high technology solutions for electronic, industrial, medical, and fabric applications. Headquartered in Newark, Delaware, W. L. Gore & Associates, Inc. is an international company with over 45 plants worldwide.
For more information, contact W. L. Gore & Associates, Inc. at 800-445-4673, +1/302-292-5100, +49/91 446010 or visit their Web site at www.gore.com/electronics.
Please send leads to:
Technical Marketing Support
W. L. Gore & Associates, Inc.
402 Vieve's Way
Elkton, MD 21922
(800) 445-4673
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