DLA-Qualified Schottky Diodes suit aerospace/defense applications.
March 14, 2013 -
Offered in Thinkey™ package that features ceramic and metal construction with no wire bonds, U.S. Defense Logistics Agency (DLA)-qualified Schottky diodes offer typical heat dissipation from 0.2 to 0.85įC/W and enable double-side cooling. Soft solder is not used in construction, and†15, 30, and 45 V ratings are available. Series includes 1N6910UTK2–1N6912UTK2 (25 A) and 1N6940UTK3–1N6942UTK3 (150 A), with anode to strap (AS) or cathode to strap (CS) polarity.
|Original Press release |
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Microsemi Delivers U.S. Defense Logistics Agency Qualified Diodes for High Density Power Aerospace and Defense Applications
High-reliability Thinkey Schottky Diodes Feature Low Thermal Resistance
ALISO VIEJO, Calif. -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today unveiled a new family of U.S. Defense Logistics Agency (DLA)-qualified Schottky diodes for aerospace and defense applications requiring high density power and excellent heat dissipation (typically 0.2-0.85 degrees C per watt (C/W). The new diodes are offered in Microsemi's patented Thinkey(TM) package, which features a rugged ceramic and metal construction with no wire bonds to improve reliability.
"Microsemi has decades of experience designing and delivering high-reliability solutions to the aerospace and defense communities," said Dr. Simon Wainwright, vice president and general manager of Microsemi's Hi-Rel group. "Our unique Thinkey package is one of the many innovations we have developed specifically to meet the stringent requirements of customers in these segments. We will continue to expand our Thinkey Schottky diode product portfolio to include additional DLA-qualified devices."
The new diodes support high-surge capabilities and enable double-side cooling. Since soft solder is not used in construction of the devices, it prevents solder seal from mixing with mounting solders and eliminates solder creep and re-crystallization during power cycling and high-temperature storage.
--† Product series 1N6910UTK2 thru 1N6912UTK2 and 1N6940UTK3 thru1N6942UTK3, anode to strap (AS), cathode to strap (CS) per MIL-PRF-19500/723/726
--† Voltage: 15V, 30V and 45V
--† Current: 25A (for 1N6910UTK2 thru 1N6912UTK2) and 150A (for 1N6940UTK3 thru 1N6492UTK3)
--† Available in JAN, TX and TXV DLA qualification levels
--† 9X lighter than TO254 package
For more information, visit http://www.microsemi.com/en/design-support/product-brochures.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
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