Product News: Electronic Components & Devices
Compact Wire-to-Board Connector offers high current capacity.
Press Release Summary:
July 8, 2014 - Available in straight, right-angle, and in-line variations from 1–6 contact positions, DF63 features 3.96 mm pitch, provides current rating of up to 15 A, and can be used with 16–18 AWG wire. Rugged crimp contact system with multi-contact points increases reliability and performance, while tactile and audible click during engagement ensures complete mating. Locking strength is 35 N min, and individual contact silos make connector finger-safe in operation.
Original Press Release
Hirose Reduces Required Mounting Area By 30% with New Wire-to-Board Connector Series
Press release date: June 26, 2014
DF63 Series connector provides high-current capacity in a compact size...
SIMI VALLEY, CA -- Hirose, a leader in the development of innovative connector solutions, has developed the DF63 connector, a robust wire-to-board connector that combines small size with high-current capacity and high reliability. Featuring a 3.96mm pitch, the DF63 Series connector provides a high current rating of up to 15 amps and is suitable for use with #16 to #18 AWG wire. Current capacity varies with pin count and wire size. This compact DF63 Series connector features up to 30% reduction in occupied board area compared to competing products.
The rugged crimp contact system with multi-contact points increases reliability and performance. The clear tactile and audible click during engagement ensures complete mating. Its locking structure provides strong retention with a minimum locking strength of 35N for demanding applications. The center position lock system and keying options allow side-by-side mounting to reduce overall package size. The DF63 also features individual contact silos which make the connector finger-safe in operation.
This series is available in straight, right-angle and in-line variations ranging from 1 to 6 contact positions (right-angle and in-line variation being available in late 2014). The DF63 is also suitable for potting or resin sealing up to a 5mm high.
"With high current capacity, a small footprint, rugged design and a user-friendly operation, the DF63 Series wire-to-board connector solves a number of design challenges for engineers. The DF63 Series is a smaller, lighter connector with improved functionality and the same electrical performance characteristics as larger competing connector products," said Rick van Weezel, Vice-President of Sales and Marketing for Hirose Electric USA.
The small size and high durability of the DF63 Series wire-to-board connector makes it well-suited for a wide range of applications including industrial machinery, industrial robotics, medical devices, networking equipment/servers, smart meters, home electronics, white goods, office equipment and gaming equipment.
The DF63 Series is RoHS compliant and UL and TÜV certified. With an operating temperature range of -35°C to +105°C, the DF63 limits contact resistance under 10m ohms maximum, and has an insulation resistance of 1000M ohms minimum at 500V DC.
For additional information about the DF63 Series connectors, please visit: www.hirose.com/us.
ABOUT HIROSE ELECTRIC
Hirose Electric Co., Ltd. is a leading global supplier of innovative interconnects, with sales of over $1 billion to customers worldwide. Hirose employs advanced engineering services, superior customer support and worldwide manufacturing capabilities to provide value-based connector solutions for various industries including: industrial, telecommunication, consumer electronics, computer and automotive. More information can be found on Hirose Electric's corporate website at www.hirose.com/us.