ATCA Blade incorporates 2 Intel Xeon CPUs and one AMC bay.March 16, 2012 -
Featuring two 1.8 GHz 8-core Intel® Xeon® processors (E5-2648L), Intel C604 chipset, DDR3-1600 memory up to 128 GB, and PICMG® mid-size AMC bay, aTCA-6200 provides telecom equipment manufacturers and network equipment providers with flexible solution for mission-critical applications and reliable path for scalability/expansion. On-card connectivity includes dual 10GBASE-KX4 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress ports, CFast socket, and 4 SAS channels.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
ADLINK Technology Inc.
8900 Research Drive
Irvine, CA, 92618
USA
ADLINK Launches State-of-the-Art ATCA Blade with Dual Intel® Xeon® Processor E5-2648L and AMC Bay
The aTCA-6200 is designed to meet the performance and flexibility requirements of NEPs and TEMs
SAN JOSE, Calif. -- ADLINK Technology, Inc. (TAIEX: 6166), a leading provider of trusted telecom computing products, today announced availability of the aTCA-6200, a next-generation AdvancedTCA® (ATCA) processor blade that demonstrates ADLINK's leadership in the development of high performance compute blades with flexible expansion capabilities. The aTCA-6200 features two 1.8 GHz eight-core Intel® Xeon® processors E5-2648L, the Intel® C604 chipset, DDR3-1600 memory up to 128GB, and a PICMG® mid-size AMC bay. On-card connectivity includes dual 10GBASE-KX4 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress ports, CFast socket, and quad SAS channels, which provide leading-edge network performance and storage capabilities. The aTCA-6200 is ideal for carrier-grade applications such as media servers in IPTV, IP Multimedia Subsystem (IMS) broadband networks, and wireless infrastructures, providing telecom equipment manufacturers (TEMs) and network equipment providers (NEPs) with a flexible, cost-effective solution for mission-critical applications and a reliable, smooth path for scalability and expansion.
"With its two eight-core Intel® Xeon® processors E5-2648L, eight sockets for DDR3-1600 VLP RDIMM memory up to 128GB capacity, and one mid-size AMC bay, the aTCA-6200 delivers the computing power of 32 concurrent threads, massive I/O and memory capacity, and flexible connectivity for high-end telecom and media server applications requiring carrier-grade performance," said Eric Kao, director of ADLINK's Embedded Computing Product Segment.
"ADLINK's aTCA-6200 is equipped with the latest Intel® Xeon® processor E5-2648L featuring an integrated memory controller and two Intel® QuickPath Interconnect (Intel® QPI) point-to-point link interfaces. Intel® QPI provides higher bandwidth with low latency connectivity from processor to processor at up to 8 GT/s," explained Steve Price, director of marketing, Communications Infrastructure Division, Intel. "With Intel® Hyper-Threading Technology and Intel® Turbo Boost Technology, the Intel® Xeon® processors E5-2648L increase the performance of both multi-threaded and single-threaded workloads and energy efficiency."
ADLINK's new aTCA-6200 provides high-speed data-transfer on the PICMG 3.1 Fabric Interface enabled by an Intel® 82599EB 10GbE Ethernet controller and Base Interface connectivity provided by Intel® 82576EB Gigabit Ethernet controllers. Versatile storage support includes four channels of SAS RAID 0/1, onboard bootable CFast socket, onboard 2.5" SATA drive space, and modular Fabric riser card for additional PICMG Fabric Interface protocols. The mid-size AMC bay supports AMC.1 PCI Express and Advanced Switching, AMC.2 Gigabit Ethernet and AMC.3 SATA/SAS storage expansion. I/O features of the aTCA-6200 include Base Interface channels, Fabric Interface channels and front/rear egress ports. Front panel I/O includes two RJ-45 GbE ports, three USB 2.0 ports, an RJ-45 to DB-9 standard serial port and a DB-15 connector for analog graphics output.
ADLINK Technology will feature the aTCA-6200 in Booth 1837 at ESC/Design West at the McEnery Convention Center in San Jose from March 27 - 29. If you plan to attend the event and would like to meet with ADLINK, please contact Monica Lanctot, marketing communications manager, at monica.lanctot@adlinktech.com or 408-360-4337 for more information. For additional product information, please go to http://www.adlinktech.com/AdvancedTCA/.
About ADLINK
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.
ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Embedded Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, and a Strategic Member of the AXIe Consortium. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).
Intel and Xeon are registered trademarks of Intel® Corporation in the United States and other countries.
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