Association News

Thermal Process Limitation Standard is available in German.

Press Release Summary:

April 22, 2009 - IPC - Association Connecting Electronics Industries® announces the German language release of J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes. This document provides test methods and classification levels to identify the worst-case thermal process limitations for all electronic components that may be processed as part of a circuit card assembly. Additionally, J-STD-075-DE includes classification categories to identify cleaning process sensitivity.

IPC-Association Connecting Electronics Industries - Bannockburn, IL

Original Press Release

IPC J-STD-075-DE Now Available in German

Press release date: April 21, 2009

Standard Classifies Worst-Case Thermal Process Limitations for Electronic Components BANNOCKBURN, Ill., USA, April 21, 2009 - IPC - Association Connecting Electronics Industries® announces the German language release of J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes. Developed jointly by IPC, JEDEC and ECA (Electronic Components Association), this document provides test methods and classification levels to identify the worst-case thermal process limitations for all electronic components that may be processed as part of a circuit card assembly, including passives, connectors, switches and other devices. "J-STD-075-DE provides classifications to cover the increased preheat, reflow or wave soldering temperatures that can cause components to melt, warp, crack, delaminate or even explode," said Jack Crawford, IPC director of certification & assembly technology. "This standard expands the coverage to all components beyond, for example, J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices, which is limited to moisture-related issues of nonhermetic integrated circuits." Additionally, J-STD-075-DE includes classification categories to identify cleaning process sensitivity. There is also a wild-card option that component manufacturers can use to identify process issues not covered by this standard. J-STD-075-DE references the packaging and labeling requirements of J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices. J-STD-075-DE may be purchased $26(U.S.) for IPC members or $52(U.S) for nonmembers. For more information or to purchase, visit the IPC online bookstore at ipc.org/onlinestore. Questions and comments about J-STD-075-DE or inquiries regarding participation in continuing standards development projects may be directed to Jack Crawford at JackCrawford@ipc.org. About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China. Contact: Anna Garrido, IPC Director of Marketing and Communications +1 847-597-2804 AnnaGarrido@ipc.org

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