Registration open for IPC's Conference on Solderability.
Press Release Summary:
December 19, 2012 - Registration is now open for IPC Conference on Solderability and Reliability for Electronics Assemblies. Scheduled for February 6-7, 2013 in Budapest, Hungary, event will open with day of educational workshops addressing PCB inspection and quality control, failure analysis, troubleshooting solder joints, repair/rework of lead-free solder joints, and conflict minerals regulations compliance. During technical conference, industry experts will discuss critical areas of assembly process.
Original Press Release
Registration Open for IPC's Conference on Solderability and Reliability for Electronics Assemblies in Budapest
Press release date: December 17, 2012
BANNOCKBURN, Ill., USA, — IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies. The event in Budapest, Hungary, February 6–7, 2013, will deliver a robust technical conference and workshops presented by leading experts.
The workshops and agenda were developed with input from electronics industry professionals in Hungary, Romania, Poland, Czech Republic, Germany and Turkey to ensure the event meets the specific needs of the growing European electronics industry.
“Early in the planning process, we asked for input from European electronics industry professionals to ensure the content of the conference and workshops would address their most pressing concerns,” says Lars Wallin, IPC European representative. “We’ve carefully selected technical experts to present information that attendees can take back to their companies and immediately put to use.”
The two-day event will open with a day of educational workshops. Bob Willis, BobWillisOnline.com, will present two workshops: one on PCB inspection and quality control for bottom-mount components (BMC), land grid array (LGA) and quad flat no-lead (QFN) designs; and another on failure analysis. Wallin will also present two workshops: one on troubleshooting solder joints and another on producing IPC Class 3 boards. In addition, Dr. Thomas Ahrens, Trainalytics GmbH, will address repair and rework of lead-free solder joints, and Fern Abrams, IPC, will discuss conflict minerals regulations compliance.
During the technical conference, industry experts will discuss critical areas of the assembly process as well as the role of design and materials on cost, reliability and turnaround time. The conference will also cover the increasing importance and effects of environmental regulations as well as future prospects for growth in Central Europe.
Technical conference presenters include Gabriele Sala, GS Consultant (Italy); Dr. Enrico Galbiati, GEST Labs S.r.l. a Socio Unico (Italy); and Peter Brent, Reed Electronics Research (UK); as well as Willis, Ahrens, Wallin and Abrams. All programs and materials will be in English.
The event will include an exhibit featuring suppliers that will show the next generation of services, equipment and materials to help attendees reach their manufacturing goals. Information about exhibiting and sponsorship opportunities is available on the conference’s website, www.ipc.org/europe-conference.
Registration for IPC Conference on Solderability and Reliability for Electronics Assemblies is available online. For more information and to register, visit www.ipc.org/europe-conference or contact firstname.lastname@example.org.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen and Beijing, China.