Original Press Release
IPC Issues Call for Participation for 2009 High Performance Electronics Cleaning and Coating Symposium
Press release date: May 11, 2009
BANNOCKBURN, Ill., USA, 11 May 2009 - IPC - Association Connecting Electronics Industries® has issued a Call for Participation for the new High Performance Electronics Cleaning and Coating Symposium. Developed by and for the industry, participation offers significant global visibility for presenters and their companies. Sponsored by IPC, SMTA and SMART Group, the event will take place 30 September 2009, in Coventry, England and will focus on all classes of high reliability and high performance electronics assembly.
"The assembly cleaning and coating marketplace has undergone rapid growth and transformation in recent years. This symposium offers a platform for experts in the market to exchange ideas and advance to next generation technology," asserts Dr. Harald Wack, president of ZESTRON America and conference committee chair. "I strongly encourage all process engineers, consultants and subject matter experts to share their experiences at this unique event."
Expert presentations are being sought in the following or related areas: cleaning equipment; cleaning and REACH, WEEE & RoHS; cleaning standards; cleaning processes; lead-free flux technology and the influence on cleaning; coating process considerations; how clean is clean: qualifying lead-free medical electronics; and environmental issues. Preference will be given to submissions in high reliability (including medical, military, automotive, aerospace and telecommunications) and high volume production segments, such as information technology.
"Three of the industry's most noteworthy associations have combined efforts to create this international symposium to showcase cutting edge technology," states Dave Torp, IPC vice president of standards and technology. "Participation is a must for those committed to cleaning and coating for the electronics industry."
Abstracts should be approximately 300 words, summarize technical and previously unpublished noncommercial work, and should include case histories, field data, new technologies, research and findings. In addition, abstracts should summarize the problems and resolutions, emphasize new techniques, and discuss results of experiments, trends of interest and benefits to the industry.
The deadline for receipt of abstracts is 22 May 2009. If selected, presentations will be due 21 August 2009. Additional conference participation information is available at IPC-SMTA-Conference-CFP or by contacting Tina Nerad, IPC coordinator of technical programs, at TinaNerad@ipc.org or Melissa Serres, SMTA director of education, at Melissa@smta.org
About IPC IPC (http://www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.