Original Press Release
IPC Technology Interchange on the Military Market Presents Challenges and Opportunities for the North American PCB Industry
Press release date: September 14, 2009
BANNOCKBURN, Ill., USA, September 14, 2009 - Which leading-edge technologies will the Department of Defense (DoD) require in coming years? What R&D is needed for the North American PCB industry to support unique DoD needs? What are the risks and repercussions of the DoD's increasing reliance on the global commercial market? Finding answers to these questions will be the focus of an IPC Technology Interchange Conference - The North American PCB Industry: It Can and Will Support the Military Market, December 9-10, 2009, at the Grand Hyatt Hotel in Washington, D.C.
The IPC Technology Interchange Conference will feature as presenters senior officers from the entire North American PCB manufacturing supply chain as well as key government officials.
U.S. Sen. Evan Bayh has been invited to give the keynote address on the electronics industry's role in protecting national security. From the Office of the Deputy Undersecretary of Defense, Sydney Pope, lead analyst for land systems, Industrial Policy, will discuss "Interconnect Opportunities and Challenges."
Addressing future technology needs from a supplier point of view, William Murphy, a Fellow with Lockheed Martin Corporation will present a view of future technology needs for military electronics from Lockheed's perspective as a prime DoD OEM.
Officers from DDi Corp., Sanmina-SCI, TTM Technologies, Endicott Interconnect Technologies, Hunter Technologies and Vulcan Flex Circuit Corporation will outline a military PCB technology roadmap developed by the IPC Executive Agent Task Force. This task force, composed of leading North American PCB manufacturers, was formed to serve as a resource to the congressionally mandated PCB Executive Agent (EA). Congress directed the DoD to appoint a PCB Executive Agent to develop an interconnect technology roadmap for the DoD; identify and create a competing network of trusted, secure PCB manufacturers; and construct policy to assure that the DoD has access to PCB manufacturing capabilities and the technical expertise necessary to meet future military requirements.
In addition, members of the IPC EA task force will provide details on Recommendations for the North American Electronic Interconnect Industry Support to the Department of Defense - specifically, six pressing recommendations for building upon and sustaining a North American PCB industry capable of supporting DoD needs and ensuring national security.
Taking a hard look at the industry's current capabilities along with future advancements needed in support of military electronics, a PCB supplier's gap analysis will be conducted by presenters focusing on laminates, plating, HDI laser equipment, ink jet printing, final finishes, solder mask and embedded actives/passives. HDI implementation for aerospace/military applications and how lead free is impacting the aerospace industry will also be topics on the conference's agenda.
For more information on the IPC Technology Interchange, visit ipc.org/technology-interchange, or contact Susan Filz, director of industry programs, at SusanFilz@ipc.org or +1 847-597-2884; or Fern Abrams, director of government relations and environmental policy, at FernAbrams@ipc.org or +1 703-522-0225.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.