IPC Technical Conference to focus on innovation.
Press Release Summary:
February 12, 2009 - IPC APEX EXPO(TM) will take place at Mandalay Bay Resort and Convention Center in Las Vegas from March 31 - April 2, 2009. It will include 35 sessions with nearly 100 papers to present leading industry research and findings. Presenting at the technical conference will be Christopher Hunt and Davide Di Maio from UK, Gerjan Diepstraten and Dr. Di Wu from Netherlands, Gregory Morose, Joe Smetana, Jennifer Nguyen, Michael H. Azarian, and Lei Nie.
Original Press Release
IPC Apex EXPO Technical Conference Inspires Next Generation of Innovation
Press release date: February 10, 2009
o From the UK, Christopher Hunt and Davide Di Maio, from National Physical Laboratory will present, A Test Methodology for Copper Dissolution in Lead-Free Alloys, a study of the effect of lead-free alloys on the copper metallization of printed circuit boards.
o From the Netherlands, Gerjan Diepstraten and Dr. Di Wu, Cobar Europe B.V., will discuss their study predicting the processability of solder pastes based on their performance under heating in Estimating Stencil Life and Ideal Heating Profile of Solder Paste Using Advanced Thermo-Gravimetric Analysis.
o Representatives from IBM Corporation and Celestica International Inc. in Canada will join forces to present, Rework Process Window and Microstructural Analysis for Lead-Free Mirrored BGA Design Points, discussing the reliability impact on components when a component on the opposite side of the board is reworked.
o From the U.S., Gregory Morose from the University of Massachusetts will present new findings to the question, "Are halogen and lead-free assemblies as reliable as the old tin-lead processed boards?" in, Long Term Reliability Analysis of Lead-Free and Halogen-Free Electronic Assemblies.
o Joe Smetana, of Alcatel-Lucent, will discuss how higher temperatures of lead-free assembly affect the performance of the printed board in, Bare Board Material Performance after Pb-Free Reflow.
o Given that lead-free solders are notorious for dissolving copper, Jennifer Nguyen, Flextronics, will talk about the steps that can be taken in printed board fabrication to reduce that danger in The Effect of Copper Plating Processes and Chemistries on Copper Dissolution.
o An overlooked aspect of lead-free solders is the difference they show in electromigration when compared to tin-lead solder. Michael H. Azarian, with the Center for Advanced Life Cycle Engineering (CALCE), will present, Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders, covering the level of liability associated with electromigration by lead-free alloys.
o In re-work, the danger of dissolving copper is magnified. Lei Nie, CALCE, will examine that danger and propose solutions to mitigate the problem in Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies. For more information on the IPC APEX EXPO Technical Conference, including full descriptions of all 35 sessions and their respective papers, visit the Show's Web site, www.IPCAPEXEXPO.org. About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China.