Original Press Release
Advances in Lead-Free Alloys, Reliability, Halogen-Free and Counterfeit Components Highlight IPC APEX EXPO 2012 Technical Conference
Press release date: December 14, 2011
New Track on Printed Electronics
BANNOCKBURN, Ill., USA, - Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012. Industry experts from around the world will present more than 100 papers in technical areas including lead-free alloys and reliability, high temperature laminates and counterfeit components as well as a new track on printed electronics.
Respected as the most selective in the electronics manufacturing industry, the IPC APEX EXPO technical conference provides a venue for the dissemination of practicable, ground-breaking research. "The Technical Review Committee has done a great job in identifying the very best of all the abstract submissions ... much of which details true industry advancements and reveals some very insightful data," says IPC Technical Conference Director Greg Munie, Ph.D. "This will help companies make better decisions about the materials and processes they use and inform them about rapid changes and opportunities in areas like printed electronics."
Over three days, 38 technical sessions will be presented. The latest advances in the areas of lead-free alloys (especially proliferation and testing) and reliability; high temperature laminates; halogen-free and how to deal with it; counterfeit components and large BGA reliability will be covered. The topics of surface finishes, test, voiding, printing, and signal integrity have multiple sessions due to the wealth of new information available.
New this year, a special track of three technical sessions on printed electronics will highlight advanced materials, emerging technologies and manufacturing processes for printed electronics as well as the standards development initiatives underway in the areas of base materials, additive materials, design and final assembly.
In addition to all the valuable content, Munie affirms, "One of the great advantages of IPC APEX EXPO is the chance to network and find solutions from multiple levels of the supply chain."
The IPC APEX EXPO Technical Review Committee is composed of Jasbir Bath, Christopher Associates Inc.; Beverley Christian, Ph.D., Research In Motion Ltd.; R. Wayne Johnson, Ph.D., Auburn University; Gary Ferrari, CID+, FTG Circuits; Patricia Goldman, P. J. Goldman Consulting; Carol Handwerker, Sc.D., Purdue University; Russell Nowland, Alcatel-Lucent; Alan Rae, Ph.D., TPF Enterprises LLC; and Dr. Munie.
To view all 38 sessions as well as the technical papers and their presenters, visit www.IPCAPEXEXPO.org/conference. Special savings of 20 percent off the technical conference or other fee-based show events is available through January 28, 2012.
To register or for more information on all the activities taking place at IPC APEX EXPO, including standards development meetings, professional development courses, executive management meetings and the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test, visit www.IPCAPEXEXPO.org.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.