IPC releases specification for rigid printed boards.
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Press Release Summary:
IPC has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. Revision D includes updated requirements for dielectric removal, HASL solder pots, printed board edges, and markings and solder mask coverage. Most anticipated addition is new microvia requirements for both capture and target lands. Annular ring, plating to land separation, and voiding in plated and copper filled structures are some examples where revision addresses microvia structures.
Original Press Release:
IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards
BANNOCKBURN, Ill., USA, — IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
This D revision caps off a multi-year effort to update the core specifications in the IPC-6010 performance series, including IPC-6013C for flexible printed boards (published in December 2013) and IPC-6018B (published in November 2011) for high frequency (microwave) printed boards, with updated acceptance criteria for HDI/microvia structures. Moving forward, IPC will be able to retire the outdated IPC-6016 specification for HDI/microvia structures that was published in 1999.
“The IPC-6012D revision represents a significant body of work by the IPC D-33a Rigid Printed Board Performance Task Group,” said John Perry, director of printed board standards and technologies at IPC. “A revision effort spanning five years, there are hardly any pages in the new revision where some level of content change or addition did not take place.”
There are many valuable additions to this revision, including updated requirements for dielectric removal, HASL solder pots, printed board edges, and markings and solder mask coverage. The most anticipated addition is for new microvia requirements for both the capture and target lands. Annular ring, plating to land separation, target land penetration and voiding in plated and copper filled structures are just some of the examples where the revision addresses microvia structures.
IPC-6012D and IPC-6012DS are available for purchase in the IPC book store.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
