Original Press Release
Free Forums Offer IPC Midwest Attendees More
Press release date: September 11, 2008
BANNOCKBURN, Ill., USA, September 11, 2008 - Some of the best things in life are free; and in two weeks, special programs at IPC Midwest Conference & Exhibition will prove just that. IPC - Association Connecting Electronics Industries® will host four Free Forums at the event, bringing a world of information on the latest in electronics manufacturing to IPC Midwest attendees.
On Wednesday, September 24, experts from STC-Madison, Panasonic Engineering, Flextronics International and Unovis Solutions will serve on a morning panel discussing Emerging Advanced Packages: Stacked, 3-D, CSP, Embedded - Surviving the Board Assembly Process. Consumer pressure for smaller, lighter electronic devices with higher performance and more features has driven innovative, small, cost-effective package designs in many formats. As product lifecycles shrink, and because boundaries between fabrication, packaging and board assembly are blurring, each link of the supply chain needs to know how to handle thinner, delicate, smaller, vertically stacked or embedded components. Developing in synergy holds the key. This forum will cover the latest in emerging packages and how these packages can be assembled on boards.
In the afternoon, the A-Line and EMS Trends Forum will be held from 1:30 pm-3:00 pm. In this interactive session, speakers from the EMS industry will discuss how they evaluate materials and equipment used in developing products. Topics include the development of a souvenir electronic assembly for the IPC Midwest A-Line (featured on the show's exhibition floor); selling customers on your capabilities; and the work that goes into prototyping/NPI.
Wednesday's Free Forums will close with a revealing session, There's More Than One Way to Assemble Lead Free: A Status Report on Processes. This forum will provide insight into what's been learned about the lead-free assembly process, including how companies train their employees on lead free, whether it's possible to run one line for both leaded and lead-free products, and how companies verify that components and boards are RoHS compliant. Since lead-free regulations went into effect, it has become painfully obvious that there is more than one way to build a lead-free electronics assembly. Is one better than another? Midwest attendees will know the answers following the forum.
On Thursday, September 25, SCRIBA: A Cross-Platform Data Entry Tool for IPC 175x Version 2.0, will be held. Representatives from the National Institute of Standards & Technology (NIST) will discuss a free, new tool for creating and editing individual 175x XML files. The NIST tool, called Scriba, supports the functionality defined in the 1750 series standards. Since IPC-1752 was released in early 2006, there have been many changes both in environmental regulations and in how companies manage the information to comply with the RoHS Directive. To address these changes, IPC's 2-18 subcommittee has updated the IPC-1750 series standards, including the move away from a form-based tool/transport mechanism to a new configuration that separates software tools from the data exchange standard itself. This forum will discuss the details of the version 2.0 schema and provide a demonstration of the Scriba 175x data editing tool.
For more information on the Free Forums at IPC Midwest or to register, visit www.IPCMidwestShow.org. A free exhibit hall pass registration is available to all pre-registrants ($25 on-site). The Exhibits Only Pass gives attendees access to the Free Forums, Free Wednesday Show Floor Reception, Free Breakfast with the Presidents session on Thursday morning, and Free Keynote Session, Secrets of the Future of Indy Cars: Where Electronics Will Be the Winning Edge, featuring Derek Daly.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
Anna Garrido, IPC Director of Marketing and Communications