IPC ESTC Keynote to address achieving exceptional package design.
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Press Release Summary:
Amkor Technology senior VP Dr. Choon Lee will deliver "System Integration Challenges in Packaging" keynote at IPC Electronic System Technologies Conference and Exhibition (ESTC) on May 22, 2013. He will present common applications and uses of micro-EMS, module-level packaging that integrates functional aspects of both SoC and SiP; discuss benefits/limitations for major market segments; talk about simulation and modeling tools; and divulge Amkor's holistic approach.
Original Press Release:
Senior VP of Amkor Technology to Deliver IPC ESTC Keynote on Achieving Exceptional Package Design
BANNOCKBURN, Ill., USA — Over the last few years, rival packaging technologies system-on-chip (SoC) and system-in-package (SiP) have converged, leading to the evolution of micro-EMS, a module level packaging that integrates the functional aspects of both SiP and SoC. Presenting the common applications and uses of these packaging types, Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.
In addition to covering the benefits and limitations of packaging types for major market segments, Dr. Lee will discuss simulation and modeling tools that are providing developers with unique insights to shorten overall development times. Moreover, he will divulge how Amkor’s holistic approach — looking at the totality of a product’s life cycle, from initial design through manufacturing and tests — is addressing challenges throughout system development.
IPC ESTC will also offer seven additional keynote presentations featuring leading industry experts from Cadence Design Systems, Intel Corporation, Lenovo, Medtronic, Microsoft, Multitest Elektronische Systeme GmbH and STATS ChipPAC, who will provide valuable insights into all arenas of system technologies.
More information on IPC ESTC is available at www.ipc.org/ESTC. For registration options, visit www.ipc.org/ESTC-register. Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by April 26 can save $100 on a technical conference registration.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
