IPC Conference to focus on flexible circuit technology.
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Press Release Summary:
IPC International Conference on Flexible Circuits, April 21-23 in Minneapolis, will feature half-day workshops on April 21 and 23 as well as full-day technical conference on April 22. Joe Fjelstad, President of Verdant Electronics, will present his keynote, Flexible Circuit Technology - New Applications, Challenges, and Solutions for the 21st Century, at the technical conference. Various industry experts will present on numerous subjects related to design, materials, and technology.
Original Press Release:
Growing Applications of Flexible Circuit Technology Subject of IPC International Conference
BANNOCKBURN, Ill, USA, February 2, 2009 - Used in a broad range of applications from high-volume consumer to high-reliability medical products, flexible circuit technology has risen from a niche interconnection solution to a mainstream technology that is increasingly becoming the interconnection method of choice in product design. From fine lines to multilayer to high density, flexible circuits offer an array of choices with a growing number of benefits. Providing timely information on the potential applications of flexible circuits, IPC - Association Connecting Electronics Industries® will host the IPC International Conference on Flexible Circuits on April 21-23 in Minneapolis.
Half-day workshops will be offered on April 21 and April 23, with a full-day technical conference featured on April 22. Joe Fjelstad, president of Verdant Electronics, will headline the technical conference with his keynote, "Flexible Circuit Technology - New Applications, Challenges and Solutions for the 21st Century."
"Understanding fully the benefits of flex circuits and the materials, design practices and methods that are employed in their manufacture will be important to many companies' future success in the electronics manufacturing and assembly industry," said Fjelstad.
Other industry experts will join Fjelstad during the technical conference to present on a number of subjects, including design for manufacturability; high-speed materials considerations; embedded passive components built on flexible substrates; technology for flexible optical interconnectivity associated with electronic circuits; optimization of the desmear and electroless copper deposition processes; flex circuit applications that require an ENIG finish; and assembly of flip-chip and SMT on flex.
In-depth, half-day workshops will cover topics such as flexible and rigid-flex circuit design principles and fabrication requirements; key aspects of desmear, metallization and electroplating of flexible and rigid-flex printed boards; flexible circuit technology: structures, applications, materials and manufacturing processes; and testing and design strategies on flexible circuits.
For more information on the conference or to register, visit ipc.org/flex-conference-2009 or contact Michelle Michelotti, IPC professional development coordinator, at +1 847-597-2822 or MichelleMichelotti@ipc.org.
About IPC
IPC (www.IPC.org ) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China.
