Original Press Release
IPC Conference on Reliability Highlights New Findings in All Areas of Electronics Assembly
Press release date: August 24, 2011
BANNOCKBURN, Ill., USA - The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection. In addition, the conference will be preceded by a full-day workshop on design for reliability in a lead-free environment.
The morning of November 1 will focus on reliability considerations with materials. Topics include: component characterization and reliability assessment of lead-free solder joints for space electronics hardware; underfill selection; an assessment of low-silver, lead-free solder alloys for general lead-free assembly; and the effect of coating and potting on the reliability of QFN devices.
The afternoon program will take a look at process issues to mitigate defects and risk. Representatives from DEK will discuss new printing techniques for miniaturization and high yield processing. Industry experts will also guide participants through the latest findings in thermal management, ESD risks and BGA processing, specifically relating to dissimilar solder alloys and avoiding head-on-pillow. In addition, Michael Osterman, Ph.D., senior research scientist, CALCE, University of Maryland, will share details of a simulated assisted reliability assessment.
Test and inspection issues dominate day two of the conference with revealing presentations from some of the industry's foremost experts on reliability. Hongtao Ma, Ph.D., electronic packaging reliability engineer, Cisco Systems Inc., will provide insight into the effects of multiple rework on ATC and shock performance of lead-free BGA assemblies. In addition, Vijay Prasad, program manager, OPS A La Carte LLC, will discuss accelerated life test planning for lead-free circuit card assemblies; Dignata Das, Ph.D, faculty research associate, CALCE, University of Maryland, will explain physics-based test methods for reliability assessment; and his colleague from CALCE, Osterman, will assess electrical failure risk induced by tin whiskers. Participants will also learn about testing the long-term reliability of an environmentally friendly PCB final finish and maximizing the value of automatic inspection systems in PCB assembly.
In a full-day, pre-conference workshop on October 31, Cheryl Tulkoff, technical staff senior member, DfR, will provide an in-depth examination of design for reliability considerations in a lead-free environment. Participants will discover the best ways to minimize risk based on a product's design, materials, complexity, volumes and customer expectations of reliability.
Participants will also have access to table top exhibits from related vendors on Tuesday and Wednesday of the conference.
For more information on IPC Conference on Reliability: Assembly Process for a Reliable Product or to register, go to www.ipc.org/reliability-conference.
About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.