Original Press Release
Latest Research on Lead-Free Implementation Challenges & New Opportunities Drives IPC APEX EXPO Technical Conference
Press release date: February 18, 2010
BANNOCKBURN, Ill., USA - In the four years since the lead-free ban in electronics manufacturing went into effect, there has been a swarm of unintended consequences - new defects, reliability concerns, processing issues and challenges for high-reliability segments. With new research now available, lead-free implementation issues and solutions will be featured at the IPC APEX EXPO(TM) Technical Conference, April 6-8, 2010, in Las Vegas.
Sponsored by IPC - Association Connecting Electronics Industries®, the conference includes 35 technical sessions featuring 99 technical papers by renowned experts in printed board manufacture, electronics assembly, environmental regulations, materials and test.
"Conference attendees this year will find a lot of sessions that delve directly into the concerns they're experiencing on the factory floor," says IPC Technical Conference Director Greg Munie. "We have sessions covering defects like pad cratering and head on pillow; tin whiskers; a new class of low-silver alloys that can better handle shock and vibration; and reliability and rework for high-reliability assemblies."
Munie notes, "Lead-free soldering is raising the bar on the engineer trying to produce reliable products. Decreased board/component stability during reflow from higher temperatures, smaller component pads, decreased wetting behavior of lead-free solder - these are problems that people are facing every day in our industry. This conference will alert them to new innovations to help them solve these problems and catch up with new findings." He adds, "So far, the focus is reaching an appreciative audience. Our registrations for the conference are ahead of the seven-week point for both 2008 and 2009."
While Munie is encouraging industry personnel to take advantage of the breadth of sessions connected to lead-free technologies, he also recommends sessions on other aspects of industry innovation. "The session on solar panel assembly should be interesting to EMS companies looking for areas for business expansion. Another session on embedded actives offers excellent insights into answers on the age old question of how to get more functionality in a smaller space."
In celebration of the APEX show's ten-year anniversary, IPC is making attending the technical conference more affordable than ever. Industry professionals can save 20 percent off any fee-based activity by registering by March 5. In addition, they are invited to save an additional $200 by entering the special promo code, APEX10, during registration. With these discounts applied, one day of the technical conference can be purchased for as little as $16.
For more information on all the activities taking place at IPC APEX EXPO, including the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test, visit www.IPCAPEXEXPO.org.
IPC (http://www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.