Original Press Release
IPC And JISSO International Council Sponsor Technical Seminar
Press release date: May 1, 2008
Implementing Advanced Interconnect Technology Solutions
BANNOCKBURN, Ill., USA, May 1, 2008 - IPC and the Jisso International Council (JIC) are sponsoring a technical seminar, Implementing Advanced Interconnect Technology Solutions, May 21-22, 2008, in Atlanta. Hosted by Georgia Institute of Technology, the event will provide information on the latest trends in interconnection technologies used in electronic products. Members of JIC and technology leaders from industry will speak on environment-friendly manufacturing, three-dimensional integration, interposer substrates, and standards activities.
Attendees will gain a comprehensive view of both integrated electronics development and manufacturing, in addition to valuable insight on interconnect technologies that will impact the electronics industry over the next ten years. Seven sessions, moderated by industry's leading experts in interconnection technologies, will comprise the two-day event. Session topics include an overview of the major areas of the total package solution; the total package solution by Jisso level; reliability and quality; thermal management solutions: energy conservation and generation; nano materials; printed and embedded electronics; and, SiP, TSVs and 3-D packaging.
"This seminar is a must for any professional wanting an in-depth understanding of the key issues in electronic interconnections," says Jean Hebeisen, IPC director of professional development. "It's the perfect opportunity for those interested in the total solution for interconnecting, assembling, packaging, mounting, and integrating system design."
For more information on this seminar or to register, visit ipc.org/JF0508 or contact Michelle Michelotti, professional development coordinator, at +1 847-597-2822 or MichelleMichelotti@ipc.org.
About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
About JIC The purpose of the Jisso International Council is to promote a strategic partnership among global organizations interested in the total solution for interconnecting, assembling, packaging, mounting, and integrating system design. The Jisso International Council is made up of key personnel from organizations within the electronics industry - EIPC, EECA, JARA, JEITA, JEDEC, JEC, Jisso Japan, JNAC, JPCA, iNEMI and IPC.