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Dow Corning Takes Prestigious 3D InCites Award for Its Advanced New Temporary Bonding Solution for 2.5D and 3D IC Innovation

Original Press Release

Dow Corning Takes Prestigious 3D InCites Award for Its Advanced New Temporary Bonding Solution for 2.5D and 3D IC Innovation

Press release date: July 17, 2013

MIDLAND, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it has won a prestigious 3D InCites Award for its innovative new Temporary Bonding Solution for 2.5D and 3D IC packaging applications. Winning the Materials category, Dow Corning accepted the award at a well-attended, invitation-only ceremony held during last week's SEMICON West 2013 in San Francisco.

3D InCites, an online media resource promoting news, discussion and collaboration in 3D IC integration and 3D packaging technologies, established its award program in conjunction with Tech Search International, a semiconductor licensing and technology firm, to recognize achievements that advance the commercialization of 2.5D and 3DIC technologies.

"Winning this award is a true honor, especially in the way it validates Dow Corning's intense and collaborative efforts to innovate the advanced materials technologies that support adoption of next-generation semiconductor packaging applications," said Andrew Ho, global industry director, Advanced Semiconductor Materials at Dow Corning. "We deeply appreciate 3D InCites' recognition of our bi-layer Temporary Bonding Solution. Our solution adopts simple, room temperature bonding and debonding process and eliminates the need for specialized equipment for wafer pre-treatment in bonding or wafer post-treatment in debonding, thereby increasing the potential for higher throughput and a lower total cost of ownership."

Both 2.5D and 3D IC integration of packaging technologies offer significant potential for increasing bandwidth and reducing the form factor of microelectronic devices targeting next-generation communication devices, while improving their electrical and thermal performance. Cost-effective temporary bonding solutions, such as Dow Corning's technology, are a key enabler for this advanced technology by bonding today's ultra-thin active device wafers to thicker carrier wafers for subsequent wafer thinning and TSV fabrication.

A panel of nine independent 3D IC industry experts selected the winners based on innovation, the ability to solve a key industry problem, and cost-of-ownership. 3D InCites readers represented a tenth judge by voting for their favorite contender online. In addition to earning the favor of the industry judges, Dow Corning also won the public online vote.

Dow Corning builds on a long history of silicon-based innovation and collaboration in semiconductor packaging. From die encapsulants for stress relief, to adhesives for sealing and bonding, to thermal interface materials for performance and reliability, Dow Corning's well-established global infrastructure ensures reliable supply, quality and support.

About Dow Corning
Dow Corning (dowcorning.com) provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company's Dow Corning® and XIAMETER® brands. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning's annual sales are outside the United States. Dow Corning's global operations adhere to the American Chemistry Council's Responsible Care® initiative, a stringent set of standards designed to advance the safe and secure management of chemical products and processes.

About 3D InCites
3D InCites is an online content source founded in 2009 in an effort to stir up interest in 3D IC integration and 3D packaging technologies. For 3D integration to happen, open collaboration across the supply chain is required. Therefore, 3D InCites strives to inform key decision makers about progress in technology development, design, standards, and infrastructure in order to realize commercial production of 2.5D and 3D technologies. 3D InCites is powered by Impress Labs (www.impresslabs.com), a global creative and marketing communications agency specializing in building brands for technology companies in the semiconductor, solar energy and life science industries. For more information, visit www.3DInCites.com.
 
The 3D InCites Awards program was established in 2013 by 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, to recognize achievements to further the commercialization of 2.5D and 3D IC technologies. Proceeds from the awards program benefit the IEEE Frances B. Hugle Engineering Scholarship, established to encourage young women to pursue careers in engineering. The 2013 3D Incites awards raised $5000 for the Frances B. Hugle Engineering Scholarship, with help from sponsors like Qualcomm, Mentor Graphics, FormFactor and Rudolph Technologies

® Dow Corning is a registered trademark of Dow Corning Corporation.
® XIAMETER is a registered trademark of Dow Corning Corporation.
® Responsible Care is a registered service mark of the American Chemistry Council, Inc.

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it has won a prestigious 3D InCites Award for its innovative new Temporary Bonding Solution for 2.5D and 3D IC packaging applications. Winning the Materials category, Dow Corning accepted the award at a well-attended, invitation-only ceremony held during last week's SEMICON West 2013 in San Francisco.


Contact:
Mirella Kimpen
Dow Corning Electronics Solutions
mirella.kimpen@dowcorning.com
+32-64-888-413

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