ThomasNet News Logo
Sign Up | Log In | ThomasNet Home | Promote Your Business

Winning Papers will be presented at IPC APEX EXPO®.

Print | 
Email |  Comment   Share  
February 24, 2012 - Winners have been announced for Best U.S. and International Papers of IPC APEX EXPO® 2012. Top honors in International category was given to "Lead-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs" by Ramon Mendez. "Investigation of Pad Cratering in Large Flip-Chip BGA Using Acoustic Emission" by Anurag Bansal was selected as best paper in U.S. category. Also, Technical Program Committee awarded 3 honorable mentions in International category and one in U.S. category.

World's Premier Electronics Manufacturing Technical Conference Selects Best International and U.S. Papers


(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: February 22, 2012

Papers to be presented at IPC APEX EXPO 2012

BANNOCKBURN, Ill., USA - IPC - Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event's Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28-March 1, at the San Diego Convention Center.

Taking top honors in the International category, the winning paper is, "Lead-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs," by Ramon Mendez, DFM/process development engineer, Celestica, in Monterrey, Mexico. His co-authors are: Ismael Marin, also with Celestica in Mexico, and Helen Lowe, Celestica Toronto, Canada. Mendez's paper will be presented on Wednesday, February 29 in S17 Solder Assembly.

"Investigation of Pad Cratering in Large Flip-Chip BGA Using Acoustic Emission," by Anurag Bansal, Ph.D., reliability engineer, Cisco Systems Inc., San Jose, Calif. was selected as the best paper in the U.S. category. Dr. Bansal's co-authors, also with Cisco Systems, are Cherif Guirguis and Kuo-Chuan Liu. Dr. Bansal will present his paper during the S31 Pad Cratering technical session on Thursday, March 1.

The Technical Program Committee also awarded three honorable mentions in the International category and one in the U.S. category. Those papers are: "Elemental Compositions of Over Two Dozen Cell Phones," by Beverley Christian, Ph.D., Research in Motion Limited, Ontario, Canada, in session S01 Environmental Compliance; "A Plasma Deposited Surface Finish for Printed Circuit Boards," by Tim Von Werne, Ph.D., Semblant Limited, Cambridgeshire, United Kingdom, in session S34 Surface Finishes II; "Warpage Issues and Assembly Challenges Using Coreless Packaging Substrate," by Jinho Kim, Samsung Electro-Mechanics Co., Ltd., Suwon Gyunggi-Do, South Korea, in session S33 PCB Warpage; and "PCB Trace Impedance Impact of Localized PCB Copper Density," by Gary Brist, Intel Corporation, Hillsboro, Ore., in session S07 Signal Integrity I.

More than 100 papers were submitted for consideration as Best Paper. Papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing.

Respected as the most selective in the electronics manufacturing industry, the IPC APEX EXPO technical conference provides a venue for the dissemination of practical, ground-breaking research. Over three days, 38 technical sessions will impart the latest advances in areas including lead-free alloys, reliability; high temperature laminates; halogen-free; counterfeit components and large BGA reliability.

To register for the IPC APEX EXPO Technical Conference or for more information on all the activities taking place, including standards development meetings, professional development courses, executive management meetings and the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test, visit www.IPCAPEXEXPO.org.

About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



 See related product stories
More .....
 See more product news in:
Services
 More New Product News from this company:
Scientific RoHS Revision Decision was praised by IPC.
More ....
| Featured Manufacturing Jobs
 Other News from this company:
IPC Crowns Winner of Hand Soldering World Championship
IPC and ITI to Host Seminars on Critical and Emerging Product Environmental Requirements
Volunteers Honored for Contributions to Electronics Industry and IPC
IPC Honors STI Electronics, Inc. and Raytheon Company with Corporate Recognition Awards
Mike Carano, Long-Time IPC Volunteer Inducted Into IPC Hall of Fame
More ....
 Tools for you
Watch Company 
View Company Profile
Company web site
More news from this company
E-mail this story to a friend
Save Story
Search for suppliers of
Trade Associations


Home  |  My ThomasNet News®  |  Industry Market Trends®  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2014 Thomas Publishing Company. All Rights Reserved.
Terms of Use - Privacy Policy



Error close

Please enter a valid email address