Photo Stencil Article "Printing and Assembly Challenges for Quad Flat No-Lead Packages" Now Available |
Photo Stencil
4725 Centennial Blvd
Colorado Springs, CO, 80919
USA
Press release date: September 10, 2012
~ Explains how QFN device challenges to the assembly process can be overcome ~
Colorado Springs, CO - Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, now makes available the article Printing and Assembly Challenges for Quad Flat No-Lead Packages. The article, written by Photo Stencil VP of Technology William E. Coleman, Ph.D, shows how with proper stencil design, proper stencil technology selection (laser, electroform, and nano-coat), and proper PCB solder mask layout the challenges that quad flat no-lead packages (QFNs) present to the assembly process can be overcome. The article can be found on the Photo Stencil website at www.photostencil.com/pdf/Mastering-QFN-Challenges.pdf.
QFNs present several assembly problems. The QFN can float during reflow if there is too much solder. Aperture size is a problem because with aperture widths as low as 0.175mm and aperture lengths as low as 0.4mm there can be a problem with the percent of paste transfer. Another challenge is the type of solder mask that's employed on the printed circuit board.
The article explores three types of solder mask designs - SMD where the pad opening on the board is defined by the solder mask, NSMD where the pad itself defines the boundary of the pad and the solder mask is pulled back off the pad (typically 0.05 to 0.075mm per side), and NSMD-Window - and gives stencil design considerations and guidelines for each type. QFN repair is also covered.
For more information, contact Photo Stencil at info@photostencil.com, visit the website at www.photostencil.com, or call 719-599-4305.
About Photo Stencil
Photo Stencil, LLC provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries. Its innovations include the patented AMTX E-FAB® electroform stencils, high-performance, proprietary NicAlloy™, NicAlloy-XT™, laser-cut, and chemetch stencils, and patented electroformed E-Blade® squeegee blade. Stencil design support and customer-specific design libraries are also provided. Founded in 1979, Photo Stencil is headquartered in Colorado Springs and has manufacturing facilities in Mexico and Malaysia. For more information follow us on www.linkedin.com/company/photo-stencil-llc, visit www.photostencil.com, or email info@photostencil.com.
Photo Stencil, LLC
Rachel Miller-Short, +1 719-304-4224
rshort@photostencil.com
or
AR Marketing, Inc. (agency)
Andrea Roberts, +1 858-451-8666
andrea@armarketinginc.com
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