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Papers, Course Proposals, Exhibitors sought for inaugural ESTC.

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October 1, 2012 - Produced by IPC, Electronic System Technologies Conference (ESTC) will take place May 20–23, with accompanying exhibition on May 21–22 in Las Vegas, and will include papers, panel discussions, professional development courses, and keynote speakers. Exhibition will bring together companies that supply to all levels of the systems technology supply chain in 24,000 ft², column-free exhibition hall. Deadline for abstract and proposal submission is November 5, 2012.

IPC Seeks Papers, Course Proposals and Exhibitors for Inaugural Electronic System Technologies Conference and Exhibition


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: September 26, 2012

BANNOCKBURN, Ill., USA – To keep the momentum of the dramatic revolution in technology and functionality of today’s electronic products, technologists must find new ways of facing the age-old problem of lighter, faster and less expensive. Bringing together the entire electronics industry – from printed board materials to component packaging and semiconductor design to complete systems – the inaugural IPC Electronic System Technologies Conference (ESTC) will take place May 20–23, 2013, with an accompanying exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas.

Tracks for the conference and professional development courses will include: product design and development; assembly and SMT; PCB fabrication, materials and design; quality and reliability; fabrication and silicon; test; equipment, tools and modules; packaging and substrates; mechanics; thermals; electrical; materials; and industry analysis and issues.

“The program will include data-driven, high-quality papers, panel discussions, professional development courses and keynote speakers,” says Senol Pekin, Ph.D., Intel Corporation, and general chair of the event. “We have been working hard to establish a well-credentialed program committee of more than 50 experienced technology professionals from across the industry. They will bring excellent technical experience to evaluating the papers and creating a program that has both depth and breadth.”

The deadline for abstract and proposal submission is November 5, 2012. For more information on presenting a paper or teaching a course, visit www.ipc.org/ESTC-CFP. For additional information on abstract submission, contact Dr. Pekin at spekin@msn.com. Questions regarding course proposal submission should be directed to Hannah Chung, Ph.D., Medtronic Inc., who is serving as the secretary for the professional development courses. Dr. Chung can be contacted at hannah.chung@medtronic.com.

The exhibition will bring together companies that supply to all levels of the systems technology supply chain in a 24,000 sq. ft. column-free exhibition hall. It is a unique opportunity to reach product specifiers and manufacturing visionaries working on tomorrow’s vital electronic products. For more information on exhibiting, contact Maria Labriola, IPC manager of trade show sales, at +1 847-597-2866 or MariaLabriola@ipc.org or visit www.ipc.org/ESTC.

ESTC is produced by IPC — Association Connecting Electronic Industries®, the producer of IPC APEX EXPO®, the largest trade show and conference for the printed board and electronics manufacturing industries.

About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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