Multisorb to Spotlight Sorbent Solutions for Consumer Electronics
Multisorb Technologies, Inc.
325 Harlem Rd.
Buffalo, NY, 14224
Press release date: December 18, 2013
Buffalo, New York – Multisorb Technologies has announced it will be showcasing its suite of sorbent technologies at the International Consumer Electronics Show in Las Vegas Nevada, January 7-10, 2014.
Multisorb's business was founded more than 50 years ago to provide sorbent solutions to the electronics industry. Its first product, Multiforms® Pressed Sorbents, is now part of a larger portfolio of Drop-In, Fit-In, and Built-In solutions aimed at preventing corrosion, intermittent functionality, adverse effects from VOCs, and other problems, including product failure, that occur from condensation within the electronic device or packaging.
Even well sealed electronic products can have failures resulting from condensation. One reason for this is ambient air containing moisture can be trapped in the device during assembly. Other reasons include minute leaks that provide the ingress of moisture through permeable materials, seals, and connectors. Moisture laden air that has permeated into the device becomes trapped and can condense with fluctuating environmental conditions that occur during shipping, storage, and operation.
Multisorb will be demonstrating a water immersion test that is used to determine if a device is liquid water tight. The test, which is performed at one atmosphere and under vacuum, quickly identifies a leak that needs to be fixed or redesigned to prevent gross leaks. When evaluating products in their lab, Multisorb's scientists, in addition to performing the water immersion test, also determine the permeability of the device housing assembly. Using this data, along with estimated service life and design life requirements, Multisorb's product design engineers can calculate the exact desiccant formulation and platform required for an electronics product to ensure reliable performance.
Platforms include Drop-In (packets and sheets), Fit-In (tapes and compressed forms) and Built-In (desiccant properties are integrated into a polymer). Compressed form desiccants, such as Multiforms® and Nat 900® Sorbents, can be formed to fit within a specific space in a device or package and are most widely used with electronic products. However, when internal space to fit a desiccant is at a minimum, desiccants integrated directly into a polymer can be injection molded into a functional, PolySorb® Component for the device, serving dual purposes.
Multisorb's research and development scientists have extensive experience working with many electronics manufacturers to develop solutions for a variety of products, such as hard disk drives, cameras, instrumentation, lasers, and more.
To find out what Multisorb can do to protect the longevity and performance of your electronic product or to see the water immersion test demonstration, be sure to stop by booth #70028.
About Multisorb Technologies
Multisorb Technologies has been an innovator in active packaging technology for more than 50 years. Founded in 1961 by John S. Cullen to protect products against the damaging effects of moisture, today Multisorb is the world leader in the development and production of active packaging components.
Multisorb's corporate offices are located at 325 Harlem Road, Buffalo, New York 14224 USA. For more information contact: Phone: +1 716-824-8900; Fax: +1 716-824-4128; E-mail: firstname.lastname@example.org; Website: www.multisorb.com.
For Further Information
Kay E. Krause