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Multisorb to Give In-Booth Presentation on Moisture in Electronics at Interpack 2014

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Multisorb Technologies, Inc.

325 Harlem Rd., Buffalo, NY, 14224, USA

Original Press Release

Multisorb to Give In-Booth Presentation on Moisture in Electronics at Interpack 2014

Press release date: April 8, 2014

Buffalo, New York – Multisorb Technologies has announced it will be showcasing sorbent solutions for electronics products at interpack 2014 in Düsseldorf, Germany. The trade fair, which operates from 8 May - 14 May, will feature 2,700 exhibitors from more than 60 countries involved with packaging and processing equipment, packaging production tools, packaging materials, and packaging services.

Multisorb will be presenting an in-booth symposium, “Moisture in Electronics” on 10 May 2014 at 11:00 am, 11 May 2014 at 3:00 pm, and 13 May at 11:00am. Moisture can cause serious issues with electronic products, including optical lens fog, insulation break down, power semiconductor failure, and corrosion of contacts and relays.  The presentation will discuss the causes of moisture inside sealed housings and the role of sorbent technology to prevent product failure, reduced service life and reduction in warranty exposure.

Multisorb’s history began with a sorbent solution for the electronics industry, and for more than 50 years, it has continued to provide innovative solutions to help combat the harmful effects that moisture, oxygen, and volatiles can have on electronic components and subsystems. To ensure reliable performance, Multisorb’s product design engineers calculate the exact sorbent formulation and platform required for your electronic product.

Platforms include Drop-In (packets and sheets), Fit-In (tapes and compressed forms) and Built-In (desiccant properties are integrated into a polymer).   Compressed form desiccants, such as Multiforms® and Nat 900® sorbents, can be formed to fit within a specific space in a device or package and are most widely used with electronic products.  However, when internal space to fit a desiccant is at a minimum, desiccants integrated directly into a polymer can be injection molded into a functional, PolySorb® component for the device, serving dual purposes.

Trusting Multisorb for your sorbent needs will ensure product reliability, enhance product performance, and minimize product failures. 

Stop by hall 11, stand 19 to see the presentation or to discuss your specific concerns. Multisorb will have a team of consultants available to speak with you.

About Multisorb Technologies

Multisorb Technologies has been an innovator in active packaging technology for more than 50 years. Founded in 1961 by John S. Cullen to protect products against the damaging effects of moisture, today Multisorb is the world leader in the development and production of active packaging components.

Multisorb’s corporate offices are located at 325 Harlem Road, Buffalo, New York 14224 USA. For more information contact: Phone: +1 716-824-8900; Fax: +1 716-824-4128; E-mail: info@multisorb.com; Website: www.multisorb.com.

For Further Information

Kay E. Krause
Multisorb Technologies
+1.716.362.9562
kkrause@multisorb.com
www.multisorb.com

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