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MIRTEC Europe and pb tec Solutions to Display the Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2014

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MIRTEC Corp.
Suite 801 - 3, 103 Dong, SK Ventium 522
Gunpo City, Korea (north)



Press release date: April 1, 2014

MIRTEC, the Global Leader in Inspection Technology, announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.

This system has won several industry awards, including the Global Technology Award (2011, 2012, and 2013) and the NPI Award (2013, 2014).

With the unique combination of 2D inspection and 3D measurement in only one head, this system achieves the highest productivity and ultimate inspection performance, and false calls are avoided. For the 3D measurement the MV-9 systems are working with the "”Shadow Free” Moiré Phase Shift image processing. Additionally they are equipped with the 6 phase colour lighting system for an optimized recognition of lifted leads.

The MV-9 utilizes a high resolution digital 15 MP camera technology with telecentric lens. The four 10 MP side cameras (Side-Viewer®) offer a spacial test and provide valuable information for a secure and reliable detection of side defects. Also, the inspection of complex components is greatly enhanced. The MV-9 is now also available with a 25 MP camera and 7.7 µm lens for components down to 03015.

Also on display will be the MS-15 In-Line SPI System. The machine also uses the shadow free Moiré Phase Shift Imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient or excessive solder, shape deformity, shift of deposition and bridging. The MS-15 uses the same high precision platform as MIRTEC’s MV-9 Series.

Both systems, the MV-9 and the MS-15, can additionally be equipped with the new CoaXPress which leads to an increase of inspection speed of around 25% compared to the standard camera technology. CoaXPress combines the simplicity of coaxial cable with state of the art high speed serial data technology. The combination of these two features provides a revolutionary leap forward in high speed image and data transmission.

Additionally on display, the MV-3 Desktop AOI System, designed to automatically inspect for manufacturing defects both pre and post reflow. The MV-3 systems offer superior fault coverage and will detect defects such as component presence/absence, polarity, miss alignment, insufficient solder, solder bridging, etc. The system software is very powerful yet extremely simple to use. With its perfect cost-performance ratio this system addresses especially companies with small and medium productions.

At the booth, visitors can learn more about MIRTEC’s total quality management system software, INTELLISYS. This software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies.

Part of this software is INTELLI TRACK which allows the user to analyze exactly the source of the failure and to eliminate this, to change information upstream and downstream to the production flow and due trend analysis enter into the process before a failure is produced at all.

For more information, stop by booth #7-504 at the show, or visit www.mirtec.com or www.pbtecsolutions.com.

Contact:
David Bennett
MIRTEC Europe
Phone: +44 (0) 1752 225321
E-mail: DBennett@Mirteceurope.com
Web: www.mirtec.com

Christel Kiechle
pb tec solutions GmbH
Phone: +49 6023 94771 11
c.kiechle@pbtecsolutions.de
www.pbtecsolutions.de
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