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Keynote Speaker, Agenda Announced for IPC/SMTA conference.

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November 12, 2012 - IPC and SMTA have jointly announced keynote speaker and topics for session 6 of IPC/SMTA High Reliability Cleaning and Coating Conference, scheduled for November 13–15, 2012 in Chicago, IL. Conference is focused on electronics assembly reliability as well as influence of cleaning and coating on producing reliable hardware. Dave Hillman of Rockwell Collins is scheduled to speak on "Printed Circuit Board Reliability: Factors OEMs Should Consider in the Age of Miniaturization."

IPC and SMTA Announce the Agenda for Session 6 of the High-Reliability Cleaning and Coating Conference

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015

Press release date: October 29, 2012

ROSEMONT, IL – Industry-leading associations IPC and SMTA jointly announce the keynote speaker and the topics you need to hear during session 6 of the IPC/SMTA High Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL. The conference is intensely focused on electronics assembly reliability, and the influence of cleaning and coating upon producing reliable hardware.

Dave Hillman of Rockwell Collins is no stranger to many of you. He is an active researcher in circuit board reliability and emerging technologies. Dave will speak on “Printed Circuit Board Reliability: Factors OEMs Should Consider in the Age of Miniaturization.”

Dave will discuss the consequences of poor design and assembly decision for high-performance electronics. As modern electronics push the envelope for smaller, faster, and more capable electronics functionality, the interaction of product design teams with the product assembly teams becomes an increasing critical function for high yield production. The path to product success can be a road of landmines if design and manufacturing factors are not selected with conscious thought early in the product design process. This presentation will cover a series of case studies reviewing and discussing how ‘poor’ choices resulted in less than ideal conditions for product design/production as the “Law of Unintended Consequences” was invoked.

To improve the design and reliability of your printed circuit assemblies and end products, come hear Dave Hillman of Rockwell Collins. For more information about the conference, visit The technical program for the conference is available at:
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