IPC revises standard for lead-free solders.April 7, 2010 -
IPC has revised IPC J-STD-609, Marking and Labeling of Components, PCBs, and PCBAs to Identify Lead, Lead-Free, and Other Attributes. Presenting marking and labeling system that aids in electronics assembly, rework, repair, and recycling, standard provides additional codes for precise specification of certain lead-free solders. It offers guidance on using range of solder alloys now available. Maximum component temperature for assembly or rework processes is also defined.
Update of IPC J-STD-609 Provides Greater Delineation of Lead-Free Solders for Marking and Labeling
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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: March 30, 2010
BANNOCKBURN, Ill., USA - IPC - Association Connecting Electronics Industries® released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
Since the original release of J-STD-609 in July 2007, many new solder alloys have entered the market as lead-free technology matures. Companies like HP were witnessing how different component suppliers using the same (new) BGA ball alloy were selecting two different "e-codes" to mark their components. To address the confusion in categorizing the new alloys, Dr. Gregory Henshall, environmental program manager for HP's Enterprise Servers, Storage and Networking Division, took an active role on the combined working group of IPC and JEDEC to pursue the A revision of J-STD-609.
"Confusion adds time and cost to the manufacture of printed circuit assemblies and also increases the chance for errors in material usage," says Henshall. "The revisions made to the standard resolve this confusion, and include examples for many common alloys."
J-STD-609A provides explicit guidance on the marking and labeling of components and printed circuit boards using the wide range of solder alloys now available in the market. Specifically, the standard enables clear identification of: assemblies with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; base materials used in PCB construction, including halogen-free resin; surface finishes; and conformal coatings. In addition, the standard prescribes the maximum component temperature that should not be exceeded during assembly or rework processing.
For more information on IPC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes, visit ipc.org/609A or contact Fern Abrams, IPC director of government relations and environmental policy, at FernAbrams@ipc.org or +1 703-522-0225.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenz