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IPC issues call for participation for 2013 IPC APEX EXPO.

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April 4, 2012 - IPC invites researchers, academics, technical experts, and industry leaders to submit abstracts for 2013 IPC APEX EXPO® at San Diego Convention Center. Expert presentations are being sought on all relevant design, PCB fabrication, and electronics manufacturing topics. Submissions dealing with lead-free processing, repair and reliability, high-speed PCB laminates, and new research in growing areas such as green technology and printed electronics are especially encouraged.

IPC Issues Call for Participation for 2013 IPC APEX EXPO


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: April 3, 2012

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2013 IPC APEX EXPO® at the San Diego Convention Center in San Diego, Calif. The technical conference will be held February 19-21, 2013, and the professional development courses will be February 17-18 and February 21, 2013.

The world's premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for "Best U.S. Paper" for U.S. authors and the "Best International Paper" for authors from outside the United States.

Expert presentations are being sought on all relevant design, PCB fabrication and electronics manufacturing topics. Submissions dealing with lead-free processing, repair and reliability, high-speed PCB laminates and new research in growing areas such as green technology and printed electronics are especially encouraged. A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by May 4, 2012. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of technical and/or appropriate test results.

In addition, course proposals are solicited from individuals interested in presenting half-day professional development courses on printed board design and manufacturing as well as electronics assembly processes and materials. Reimbursement for travel expenses and an honorarium are offered to course instructors.

Technical conference paper abstracts and course proposals are due May 4, 2012. To submit an abstract or proposal, visit www.IPCAPEXEXPO.org/CFP.

For more information about conference presentations, contact Greg Munie, IPC conference director, at GregMunie@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org or +1 847-597-2825.

For more information about half-day PD courses, contact the IPC professional development program manager at AnneMarieMulvihill@ipc.org or +1 847-597-2827.

About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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