IPC Winter Webinar Series offers employee training.February 8, 2011 -
Bringing IPC technical information to large number of employees at one time, Winter Webinar Series focuses on technical challenges facing electronics manufacturing industry, including lead-free reliability issues, high voltage PCB design, package on package assemblies, thermal cycle testing, and barrel failures. In addition to technical webinars, 30-min webinars covering the findings of the latest IPC market studies and statistical programs will be presented.
IPC Winter Webinar Series Offers Employee Training in the Comfort of a Company's Conference Room
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: February 4, 2011
Market Update Webinars Also Offered
BANNOCKBURN, Ill., USA, - IPC announces its Winter Webinar Series for February and March 2011. Focused on technical challenges facing the electronics manufacturing industry, including lead-free reliability issues, high voltage PCB design, package on package (PoP) assemblies, PoP component manufacturing, thermal cycle testing and barrel failures, the one-hour webinars offer companies a great opportunity to bring IPC technical information to a large number of employees at one time.
The following webinars will run from 10:00 am to 11:00 am Central time:
High Voltage PCB Design
Robert Tarzwell, DMR, Ltd.
Tuesday, February 15, 2011
High Reliability: Solving Problems with Reliability, Repair and Rework in the Lead-Free Era Cheryl Tulkoff, CRE, DfR Solutions.
Wednesday, February 16, 2011
Interconnect Durability of Package on Package Assemblies
Michael Osterman, Ph.D., CALCE Electronic Products & System Consortium, University of Maryland
Tuesday, February 22, 2011
An Investigation into the Development of Lead-Free Solder Paste for PoP (Package on Package) Component Manufacturing Applications
Jasbir Bath, Christopher Associates
Thursday, February 24, 2011
Influence of Solder Reflow Process and Parameters on PoP Component Assembly
S. Manian Ramkumar, Ph.D., Rochester Institute of Technology - Center for Electronics Manufacturing and Assembly.
Wednesday, March 2, 2011
Thermal Cycle Testing of Printed Boards - Barrel Failures
Paul Reid, PWB Interconnect Solutions
Wednesday, March 9, 2011
The registration fee of only $75 for IPC members covers as many employees as can fit comfortably in a company's own conference or training room. The registration fee for nonmembers is $100. For more information and to register, visit www.ipc.org/Winter-Webinars.
In addition to IPC's technical webinars, 30-minute webinars covering the findings of the latest IPC market studies and statistical programs will be presented by IPC Director of Market Research Sharon Starr. On February 8, Market Update for the Assembly Equipment Industry will be presented at 10:00 am Central time. Market Update for the Electronics Chemicals Industry will be presented March 8 at 10:00 am Central time. The market research webinars are free for IPC members and $25 for nonmembers. For more information or to register, visit www.ipc.org/market-research-webinars.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.