IPC White Paper offers facts on HDI technology.June 3, 2009 -
An Executive Overview of HDI, "The Reality of HDI: Fact vs. Myth" clarifies facts and misconceptions surrounding high-density interconnect (HDI) technology. Developed by IPC PCB Management Council Steering Committee, it offers key reasons to support manufacture of HDI PCBs and facts regarding expense. Paper addresses ways HDI helps meet industry demands and presents survey results and analysis of market opportunities.
IPC White Paper Examines the Myths and Facts of HDI Technology for North American Manufacturers
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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: May 19, 2009
BANNOCKBURN, Ill., USA, May 19, 2009 - IPC - Association Connecting Electronics Industries® has released a new white paper, An Executive Overview of HDI The Reality of HDI: Fact vs. Myth, to clarify the facts and misconceptions surrounding high density interconnect (HDI) and dispute the argument that the North American PCB industry cannot produce HDI boards. Developed by the IPC PCB Management Council Steering Committee, the document provides key reasons supporting the manufacture of HDI printed circuit boards (PCBs) and facts regarding the expense of HDI.
The need for HDI is being driven by vital industry demands, including miniaturization, lower costs, and improved reliability. This paper addresses the ways HDI technology adds efficiency and quality in meeting those demands, and presents survey results and analysis of market opportunities as well as information on cost implementation and advantages. The white paper also serves as a starting point for senior level executives in the PCB industry looking to break into the HDI market.
"Manufacturing HDI is critical to remain competitive," contends Peter Bigelow, president and CEO of IMI, Inc. and chairman of the IPC PCB Management Council Steering Committee. "Research data supports the conclusion that HDI will become pervasive in every application and is already considered to be mainstream technology in many. Yet in 2007, North American production represented only 3.4 percent of the world market in HDI technology. North American PCB manufacturers need to realize that the barriers to HDI can be overcome."
In addition to Bigelow, steering committee members who contributed to the white paper are: Jay Desai, director of marketing for Multi-Fineline Electronix, Inc.; Terry Heilman, president and CEO of Sunstone Circuits, LLC; Nilesh Naik, CEO of Onesource Group; Joseph O'Neil, president of Hunter Technology; Greg Papandrew, president of Bare Board Group; Ren Sanscrainte, global account manager of Viasystems Technology Corp. LLC; and Al Wasserzug, director of business development for Vulcan Flex Circuit Corporation.
IPC members can download the white paper for free at www.ipc.org/HDI-Executive-Overview. For more information about the white paper, contact Susan Filz, IPC director of industry programs, at +1 847-597-2884 or SusanFilz@ipc.org.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.