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IPC Issues Call for Participation for 2011 IPC Apex Expo.

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May 21, 2010 - IPC is encouraging submission of abstracts for 2011 IPC APEX EXPO(TM) to be held in Las Vegas, April 12-15, 2011. Summarizing original and unpublished work, 300 word abstracts covering case histories, research, and discoveries must be submitted by July 16, 2010. Awards will be presented at event for Best U.S. Paper and Best International Paper. Also, proposals are solicited for professional development courses on design, printed board, and electronics manufacturing processes/materials.

IPC Issues Call for Participation for 2011 IPC Apex Expo


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: May 11, 2010

BANNOCKBURN, Ill., USA - IPC - Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for 2011 IPC APEX EXPO(TM) at the Mandalay Bay Convention Center, Las Vegas, April 12-15, 2011.

The world's premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for "Best U.S. Paper" for U.S. authors and the "Best International Paper" for authors from outside the United States.

Expert presentations are being sought on all relevant design, PCB fabrication and electronics manufacturing topics. Submissions dealing with reliability, head-on-pillow and lead-free repair and rework, as well as new research in growing areas such as photovoltaics and printed electronics are especially encouraged. A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by July 16, 2010. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of the technical and/or appropriate test results in the final paper.

In addition, proposals are solicited for full-day and half-day professional development (PD) courses on design, printed board and electronics manufacturing processes and materials.

Technical conference paper abstracts and PD proposals are due July 16, 2010. To submit an abstract or proposal, visit www.IPCAPEXEXPO.org/CFP. For more information about conference presentations, contact Greg Munie, IPC conference director, at GregMunie@ipc.org or Toya Richardson, IPC technical administrative assistant, at ToyaRichardson@ipc.org or +1 847-597-2825. For course proposal information, contact Anne Marie Mulvihill, IPC professional development program manager at AnneMarieMulvihill@ipc.org or +1 847-597-2827.

About IPC
IPC (http://www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.

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