IPC Conference aims to clean up reliability problems.October 31, 2013 -
Although no-clean practices have altered printed board manufacturing processes, reliability expert Cheryl Tulkoff warns that, "Everyone should be thinking about cleaning and contamination issues." Tulkoff, of DfR Solutions, is among the experts who will address wide range of factors impacting reliability at IPC Conference on Solder and Reliability, Nov 13–14. Conference will also cover properties of solder alloys, defects like pad cratering, risk mitigation processes, and data analysis.
IPC Conference to "Clean Up" Reliability Problems
IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: October 28, 2013
BANNOCKBURN, Ill., USA, — Although no-clean practices have altered printed board manufacturing processes, reliability expert Cheryl Tulkoff warns that, “Everyone should be thinking about cleaning and contamination issues.” Tulkoff, DfR Solutions, is among the experts who will address the wide range of factors impacting reliability at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
In the drive toward array packaging and other bottom termination configurations Tulkoff says, “We’re seeing many more failures: more sneaky failures, odd or unusual things.” Manufacturing processes can be optimized to minimize problems and testing can help detect boards with defects, but the best way to avoid problems is to think about potential reliability issues in the design phase. She adds, “In the design phase, you can create alleys or pathways in the solder mask, and in stencil designs to allow the materials to get away from the chips. Another essential step – before manufacturing even begins – is to start with clean bare boards.”
In addition to presentations on cleaning and contamination issues, the conference agenda will cover a variety of topics, including: strategic reliability considerations, properties of solder alloys, defects like pad cratering, risk mitigation processes and data analysis. Speakers will also provide updates on: adhesives and packaging, key challenges in assembly and attachment, changes in component manufacturing as companies move from gold to copper wire bonding for cost savings and the proliferation of lead-free alloys.
IPC Conference on Solder and Reliability follows the 7th International Symposium on Tin Whiskers, which runs Tuesday, November 12 through noon on Wednesday, November 13. These back-to-back events provide an ideal setting for a comprehensive update on reliability issues, with access to people who are experts in their fields.
Complete agenda and registration information for the IPC Solder and Reliability Conference can be found at www.ipc.org/solder-reliability.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C..; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.