IPC Announces Winning Papers of IPC APEX EXPO 2013.February 18, 2013 -
IPC announced winners of Best U.S. and International Papers of IPC APEX EXPO® 2013. Top honors in U.S. category went to "Double Reflow-Induced Brittle Interfacial Failures in Lead-Free Ball Grid Array (BGA) Solder Joints" by Julie Silk of Agilent Technologies. "Manufacturability and Reliability Screening of Lower Melting Point Lead-Free Alloys Containing Bismuth" by Polina Snugovsky, Ph.D., of Celestica Inc. was selected as best paper in International category.
Technical Papers Take Top Honors at IPC APEX EXPO |
IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA
Press release date: February 14, 2013
Winning Papers to be Presented at Technical Conference
BANNOCKBURN, Ill., USA, IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013. Selected through a ballot process by the event’s Technical Program Committee, the winning papers will be presented during the conference, February 19–20, at the San Diego Convention Center.
Taking top honors in the U.S. category, the winning paper is, “Double Reflow-Induced Brittle Interfacial Failures in Lead-Free Ball Grid Array (BGA) Solder Joints,” by Julie Silk, Agilent Technologies. Her co-authors include: George Wenger and Andrew Giamis, Andrew Corporation; Richard Coyle, Alcatel-Lucent; and Jon Goodbread, Agilent Technologies. The team’s paper will be presented on the afternoon of Wednesday, February 20, during technical conference session 21, Solder and Alloy Reliability III.
“Manufacturability and Reliability Screening of Lower Melting Point Lead-Free Alloys Containing Bismuth,” by Polina Snugovsky, Ph.D., Celestica Inc., was selected as the best paper in the International category. Dr. Snugovsky’s co-authors are: Eva Kosiba, Jeffrey Kennedy, Zohreh Bagheri, and Marianne Romansky, Celestica Inc.; and Michael Robinson, Joel Heebink and Joseph Juarez, Jr., Ph.D., Honeywell. This paper will be presented Tuesday, February 19, during technical conference session 3, Assembly Reliability I.
More than 100 papers were submitted for consideration as Best Papers. Papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing.
Copies of the winning papers will be included in the 2013 IPC APEX EXPO Technical Conference Proceedings which will be available for purchase mid-March through the IPC Online Store. Additionally, the winning papers will be published in IPC Outlook, IPC’s weekly e-newsletter.
To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place, visit www.IPCAPEXEXPO.org.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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