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Experts to Show how to turn the tables on field failures.

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August 27, 2009 - On September 24, 2009, industry experts will provide insight into failure analysis via a series of free forums on acceptability, reliability, and failure analysis held in conjunction with IPC Midwest in Schaumburg, IL. Attendees will learn intricacies of ensuring reliability throughout the lifecycle of electronic products and systems as failure analysts present technical case studies and provide how-to guidance on show floor.

Experts Show How to Turn the Tables on Field Failures at IPC Midwest Free Forums


(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: August 25, 2009

BANNOCKBURN, Ill., USA, August 25, 2009 - After a product has been successfully built, delivered to the customer, and put in the field, something bad can happen - it can come back. Failure analysis has always been on the final frontier of electronics assembly, but for one day at IPC Midwest Conference and Exhibition, it is getting bumped to the front of the line. On Thursday, September 24, industry experts will provide unique insight into the world of failure analysis in a series of Free Forums on acceptability, reliability and failure analysis held in conjunction with IPC Midwest, at the Renaissance Schaumburg Hotel & Convention Center, Schaumburg, Ill.

As unpopular as the phrases "field failure" or "product returned from field" are, they are a fact of life for all companies at some point. IPC Midwest attendees will learn the intricacies of ensuring reliability throughout the lifecycle of electronic products and systems as the world's foremost failure analysts present technical case studies and provide how-to guidance through the Free Forums on the show floor of IPC Midwest:

10:15 am Cross-Sectional Preparation of Specialty and Problematic Components

Richard Wagner and Gabe Lucas of Buehler Ltd. will use actual case studies to help attendees explore cross-sectioning techniques for identification of failure sites and verification of failure mechanisms.

11:00 am Advanced Applications of XRF for Lead Detection on Electronic Assemblies

Paul Lomax of Fischer Technology Inc. will review a new technique for reliably identifying unknown samples of material for the presence of lead utilizing XRF instrumentation.

11:45 am Are the Test Results in Your C of C Still Applicable to the Products You're Buying?

Debby Obitz and John Radman of Trace Laboratories will discuss what happens when materials tested don't meet the requirements of the specification that the Certificate of Compliance (C of C) states have been met. Attendees will learn which material purchases are the largest risks for the OEM and determine what questions need to be asked when receiving that C of C.

12:30 pm Implementing the New IPC Thermal Stress, Convection Reflow Assembly Simulation Test Method IPC-TM-650, Method 2.6.27

Chris Mahanna, Robisan Laboratory will help attendees get a handle on the implementation, qualification and ongoing verification of IPC's new industry test method that simulates convection reflow rather than traditional wave soldering.

1:15 pm Analytical Methods of Detecting Lead in Electronic Assemblies

Mike Fredrickson and Carmine Meola of ACI Technologies Inc./EMPF will discuss recent advances in nondestructive methods of quantifying lead in electronic products through spectroscopy, fluorescence and other elemental analysis.

2:00 pm Failures Resulting from Cleanliness: What to Test?

Joe Russeau with Precision Analytical Laboratory, Inc. will show how failures resulting from cleanliness can be among the most difficult to diagnose and explain the disconnect between understanding what causes a fault and identifying the origin of the residue(s) that played a role in the fault.

2:45 pm Creep Corrosion - Immersion Silver Corrosion Issues

Terry Munson of Foresite Inc. will show how cleaning to remove creep corrosion and other contaminates prior to conformal coat applications is proving to be very effective.

The Acceptability, Reliability & Failure Analysis Free Forums are available free of charge to all IPC Midwest attendees. A free Exhibits Only registration is available to pre-registrants ($25 on-site). For more information on all of the Free Forums at IPC Midwest, visit IPCMidwestShow.org/free-forums. For information on all of the activities at IPC Midwest Conference and Exhibition or to register, go to www.IPCMidwestShow.org.

About IPC

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.
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