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Call for Participation issued for IPC Midwest conference.

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March 13, 2012 - Researchers, academics, technical experts, and industry leaders are invited to submit abstracts on materials and processes contributing to performance of printed board assemblies for technical conference at IPC Midwest Conference and Exhibition(TM). Deadline is April 2, 2012, and submissions should detail case histories, field data, new technologies/innovation, or research and findings as well as summarize problems and resolutions, procedures, results of experiments, and industry benefits.

Call for Participation Issued for IPC Midwest Conference & Exhibition


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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
USA



Press release date: March 9, 2012

BANNOCKBURN, Ill., USA - IPC -Association Connecting Electronics Industries® has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition(TM). The one show in the Midwest focused on printed boards and electronics manufacturing, this year's event will take place August 22-23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.

Expert presentations are being sought in the areas of:
  • Adhesives
  • Cleaning Materials
  • Conformal Coatings
  • Design for Manufacturability
  • Design for Reliability
  • Design for Test
  • Electronic Materials
  • Fluxes
  • Handling and Storage
  • ICT
  • Incoming Inspection
  • Interconnection Performance
  • Moisture Sensitivity
  • Optical/Laser Inspection
  • Pick and Place
  • Potting and Encapsulation
  • Process Control
  • Printing/Jetting
  • Reflow and Wave Soldering
  • Selective Soldering
  • Solders
  • Solderability
  • Solder Mask
  • Testing
  • Tin Whiskers Risk Mitigation
  • X-Ray Inspection

    Abstracts must be submitted by April 2, 2012, and should detail case histories, field data, new technologies or innovation, or research and findings. In addition, abstracts should summarize the problems and resolutions, procedures used, results of experiments and benefits to the industry.

    Oral presentations will be limited to 20 minutes, plus an additional 10 minutes for questions and answers. Presentations must be noncommercial and focused on technology rather than a company's product and must not have been previously presented.

    To submit an abstract, visit www.IPCMidwestShow.org/CFP. For more information about participation, visit www.IPCMidwestShow.org or contact John Perry, technical conference director, at JohnPerry@ipc.org or +1 847-597-2818.

    About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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