Best Technical Papers will be presented at IPC Apex Expo 2014.
Press Release Summary:
March 28, 2014 - Voted on via ballot by IPC Technical Program Committee members, best U.S. and International Papers of IPC APEX EXPO® 2014 have been selected. Authors will receive awards during Opening Keynote Session on March 25, and winning papers will be presented during conference. Top U.S. category honors went to "Reliability Screening of Lower Melting Point Lead-Free Alloys Containing Bismuth, while "Advanced Thermal Management Solutions on PCBs for High Power Applications" won International category.
IPC-Association Connecting Electronics Industries
Original Press Release
Best Technical Papers at IPC Apex Expo 2014 Selected
Press release date: March 20, 2014
BANNOCKBURN, Ill., USA — The best U.S. and International Papers of IPC APEX EXPO® 2014 have been selected. Voted on through a ballot process by members of IPC’s Technical Program Committee, the authors will receive their awards during the Opening Keynote Session on Tuesday, March 25 and the winning papers will be presented during the conference, March 25–27, at the Mandalay Bay Convention Center in Las Vegas.
Taking top honors in the U.S. category, the winning paper is, “Reliability Screening of Lower Melting Point Lead-Free Alloys Containing Bismuth,” by Joseph Juarez Jr., Ph.D., Honeywell Inc. Air Transport Systems. His co-authors include: Michael Robinson and Joel Heebink, Honeywell Inc. Air Transport Systems; Polina Snugovsky, Ph.D., Eva Kosiba, Jeffrey Kennedy, Zohreh Bagheri, Suthakaran Subramaniam and Marianne Romansky, Celestica. The team’s paper will be presented Wednesday, March 26 during the technical conference session on solder mixing and reliability (S14).
“Advanced Thermal Management Solutions on PCBs for High Power Applications,” by Markus Leitgeb, AT&S Austria Technologie & Systemtechnik AG, was selected as the best paper in the International category. Leitgeb’s co-authors are: Gregor Langer, AT&S; Hans Hoschopf, Tridonic Jennersdorf GmbH; Johan Nicolics and Michael Unger, Institute of Sensor & Actuator Systems, Vienna University of Technology; and Franz P. Wenzl, Institute for Surface Technologies and Photonics, Joanneum Research Forschungsgesm b.H. This paper will be presented Tuesday, March 25 during the technical conference session on PCB thermal considerations and management (S02).
The best conference papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing.
Copies of the winning papers will be included in the 2014 IPC APEX EXPO Technical Conference Proceedings which will be available for purchase mid-April through the IPC Online Store. Additionally, the winning papers will be published in IPC Outlook, IPC’s weekly e-newsletter.
To register for the IPC APEX EXPO Technical Conference or for more information on all the activities taking place, including standards development meetings, professional development courses, executive management meetings and the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test, visit www.IPCAPEXEXPO.org.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,400 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.