ADLINK Technology Presents PC/104-Plus and EPIC SBCs Equipped with Latest Intel® Atom(TM) E600 and Intel® Core(TM) i7 Processors |
ADLINK Technology Inc.
8900 Research Drive
Irvine, CA, 92618
USA
Press release date: November 15, 2011
Ruggedized boards with various I/Os to advance embedded design innovation for demanding applications
SAN JOSE, Calif., -- ADLINK Technology, Inc., a leading global provider of ruggedized embedded products, announces the release of its latest Ampro by ADLINK(TM) Extreme Rugged(TM) CoreModule® 720 PC/104-Plus Single Board Computer (SBC) with Intel® Atom(TM) Processor E600 Series and Rugged ReadyBoard(TM) 910 EPIC SBC with 2nd Generation Intel® Core(TM) i7/i5/i3 and Celeron® processors. Both SBCs feature onboard Solid State Drives (SSD) and provide a compact form factor suitable for applications in harsh environments such as transportation, self-service, digital signage, and video surveillance.
"ADLINK is committed to working with the Intel® roadmap to provide rugged embedded designs with high performance processors and generous on-board Input/Output (I/O) functions to support rugged application requirements," said Jeff Munch, CTO of ADLINK Technology. "As a standards-leader, we strive to raise the bar for rugged design so that our customers are able to create ever more innovative applications using compact form factor technology."
The Ampro by ADLINK CoreModule 720 is based on the Intel® Atom(TM) Processor E600 series from 600 MHz up to 1.6 GHz. The PC/104-Plus stackable form factor allows customers to build low power solutions for space constrained, extreme rugged environments. The CoreModule 720 is a PC/104-Plus SBC with PCI and ISA bus connectivity and provides an integrated 4GB SSD, CAN bus, SATA, and a broad range of peripheral I/O support. Additional features of the CoreModule 720 include support for up to 2 GB soldered DDR2 SDRAM at 600/800 MHz and 24-bit LVDS and SDVO graphics. The Intel® Platform Controller Hub EG20T accommodates a wide range of common I/Os, such as USB, SATA, GbE, SDIO, Serial, and CAN bus. Designed to meet stringent shock and vibration requirements, the CoreModule 720 uses 50% thicker printed circuit board (PCB) and supports an extended temperature range of -40 degrees C to +85 degrees C.
The Ampro by ADLINK ReadyBoard 910 integrates the 2nd Generation Intel® Core(TM) i7/i5/i3 and Celeron® processors (Socket G2) and mobile Intel® HM65 Express chipset, onboard SSD, and robust I/O in a compact EPIC form factor. The ReadyBoard 910 supports three display interfaces, including analog VGA, LVDS, and DVI-D, and features dual Gigabit Ethernet, SuperSpeed USB 3.0 with 5 Gb/s data transfer rate, PCI Express Mini Card socket, and PCI-104 expansion.
ADLINK's Extreme Rugged boards and systems are designed for harsh environments from the ground up. Robust test methods, including Highly Accelerated Life Testing (HALT), ensure optimal product design phases and meet stringent requirements, such as -40°C to +85°C operating temperature range, MIL-STD, shock and vibration, and long-term reliability. The Rugged product line achieves a middle ground between industrial and Extreme Rugged applications that experience less shock and vibration and operate within a -20 degrees C to +70 degrees C temperature range.
For more information on Ampro by ADLINK Rugged and Extreme Rugged SBCs or to get a quote, please visit http://www.adlinktech.com/ampro-extreme-rugged/single-board-computers/.
About ADLINK Technology
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.
ADLINK is ISO-9001, ISO-14001, ISO-13485, and TL9000 certified, is an Associate Member of the Intel® Embedded Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, and a Member of the AXIe Consortium. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).
Web Site: http://www.adlinktech.com
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