U.S. Export Authority, Inc.
San Jose, CA 95112
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CSP Production Line produces 2,000,000 devices per week.
Chip Scale Package (CSP) Production Line electrically sorts, laser marks, visually inspects, tapes, and reels multiple wafer scale devices such as standard or bumped die as small as 0.5 mmÃ-² and QFN packages. Inkless process, based on wafer mapping program, electronically merges bump maps, electrical sort maps, and vision inspection maps into one composite map that controls selection and...
Read More »Best Electronics and U.S. Export Authority Hires Director of World Wide Sales
Industry veteran Fabian Naudin hired as Director of World Wide Sales in new position created to focus company's efforts to expand into rapidly growing market for new, smaller QFN / DFN semiconductor packages. San Jose, California, June 216, 2007 - U.S. Export Authority, Inc (USEA) and it's affiliated production company, Best Electronics and Components Company, Inc. (BECCI), a world leader in...
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CSP Production Line produces 2,000,000 devices per week.
Chip Scale Package (CSP) Production Line electrically sorts, laser marks, visually inspects, tapes, and reels multiple wafer scale devices such as standard or bumped die as small as 0.5 mmÃ-² and QFN packages. Inkless process, based on wafer mapping program, electronically merges bump maps, electrical sort maps, and vision inspection maps into one composite map that controls selection and...
Read More »