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Nordson ASYMTEK

Material Handling & Storage

Precision Fluid Dispensing System suits cleanroom applciations.

July 7, 2014

Offering multiple built-in closed-loop process controls, 600 mm wide Spectrum™ II Cleanroom Series includes Class 100 (ISO 5)-compatible configurations for applications sensitive to contamination by submicron-sized particles. Modular design facilitates adaptation and upgrades, while Fluidmove® v6.0 software features promote consistent machine-to-machine performance. Other features include stainless steel system enclosure, ULPA filter, and high-speed operation. Read More

Test & Measuring Instruments

Inline PCB Inspection System utilizes 9 MP color camera.

April 2, 2014

With 1 top-down viewing camera, 4 side-viewing cameras, and 3D inspection, Model FX-940 is suitable for inspection of solder defects, lead defects/lifted leads, component presence/position, correct part/polarity, through-hole parts, and co-planarity of chips and BGAs. System is configurable for all line positions and equally effective for paste, pre/post-reflow, and final assembly inspection. Other features include real-time SPC monitoring and Advanced Fusion Lighting. Read More

Machinery & Machining Tools, Material Handling & Storage

Solder Paste Dispensing System combines speed and accuracy.

November 14, 2013

Occupying 600 x 1,321 mm footprint, Spectrum™ II S2-900 Series provides 3-axis (X/Y/Z) precision fluid dispensing at speeds up to 30,000 dots/hr for microelectronics and semiconductor manufacturing and MEMS and LED assembly. Precision Z-axis performance enables consistent <200 µm dots and solder paste line dispensing for MEMS and HDD assembly, while Tilt Jetting capability allows precision coating and underfill in hard to reach areas. Non-contact laser height sensors are standard.
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Material Handling & Storage, Packaging Equipment, Laboratory and Research Supplies & Equipment

Batch Fluid Dispensing System suits cleanroom applications.

August 14, 2013

Certified for Class 100 cleanroom use, Spectrum™ S-820-C performs with range of fluids, processes, and substrates used in electronics packaging and assembly. Stainless steel enclosure, enclosed keyboard, and cable design reduce particle generation, and optional HEPA filter can be added for downward air flow. Other options include laser height sensor and dual-action dispensing head. Mass Flow Calibration, Calibrated Process Jetting, and Jet-on-the-Fly features are standard. Read More

Software

Manufacturing Software optimizes jetting underfill for flip chips.

July 29, 2013

Used for jetting underfill for flip chips, Continuous Path Motion Control software optimizes dispense head motion to conserve time and increase units per hour (UPH). Dispense head maintains continuous speed and direction throughout process instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating. Depending on actual die layout, dispensing conditions, flow rate, and other factors, software conserves 23% dispensing cycle time at 9 mg/sec flow rate. Read More

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Nordson ASYMTEK