Company News

ROHM Semiconductor USA, LLC

6020 Cornerstone Court West, Suite 320, San Diego, CA, 92121, USA

  • 858-625-3600

Latest New Product News from
ROHM Semiconductor USA, LLC

Electrical Equipment & Systems

BD9227F DC/DC Converter features internal frequency control.

Apr 21, 2017

Integrating high-side PMOS, BD9227F DC/DC Converter is housed in 5.00mm x 6.20mm x 1.71mm SOP8 package. Operating in -40°C to 85°C temperature range with 6V to 20V voltage supply, unit’s linear output voltage control ensures accurate controlling of motor rotational speed. Used in cold air circulation applications, converter provides 1.0MHz switching frequency and 1A of output current. Unit... Read More

Computer Hardware & Peripherals

Thermal Printheads are powered by single-cell li-ion battery.

Mar 29, 2017

Utilizing special low resistance heat elements and optimized to improve heat storage characteristics, KR2002-D06N10A Thermal Printheads feature comparatively smaller head size as it combines printed circuit board and ceramic substrate to improve applied energy efficiency by 20% over ROHM’s conventional 2-cell drive products. Maintaining print quality even with single cell drive, device is... Read More

Sensors Monitors & Transducers

KXTJ3 Accelerometer features built-in voltage regulator.

Mar 24, 2017

Used in pet monitors, smart tags, beacons and key fobs, KXTJ3 Accelerometer can operate with low 1.5uA at its lowest ODR of 0.781Hz. Offering g-ranges of 2g, 4g, 8g, or 16g and resolution modes up to 14g, unit comes in 2mm x 2mm x 0.9mm form factor. Featuring embedded motion wake-up engine with 3.9mg threshold, unit supports I2C protocol up to 3.4MHz.

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Computer Hardware & Peripherals

ML630Q464/466 Microcontrollers come with ARM Cortex M0+ 32bit CPU core.

Mar 20, 2017

Operated in -40°C to +85°C temperature with 1.8V to 3.6V input supply, ML630Q464 and ML630Q466 Microcontrollers provide ±0.5℃ temperature measurement accuracy. Incorporating USB I/F, high-speed clock generator, LCD driver and RC oscillation type ADC, units come in TQFP100 package. Suitable in PDF file generation, data acquisition and data logging, units consume 0.8uA current and support... Read More

Electrical Equipment & Systems, Electronic Components & Devices

MSL0402RGBU 3-Color LED does not need Zener diode.

Feb 02, 2017

Preventing light emission of unnecessary blocks in matrix circuits, MSL0402RGBU 3-Color LED features high ESD resistance element. Fabricated with gold plated substrate for preventing sulfuration, unit comes in 1.8 mm x 1.6 mm size. Delivering brightness ranging in 180-550 mcd, LED is rated to 20 mA IF current and VF voltage ranging in 2.1 to 3.5 V. Product is used in matrix and display light... Read More

Electronic Components & Devices

UDZLV and KDZLV Series Zener Diodes are AEC-Q101 compliant.

Dec 22, 2016

Comprising 12 models in Zener voltage range of 51V to 150V, UDZLV and KDZLV Series Zener Diodes feature rated power of 0.2W and 1.0W respectively. With compact 2.5mm x 1.2mm sized package, UDZLV is suitable for consumer electronics and automotive ECUs, MFPs, and inkjet printers. Available in 3.5mm x 1.6mm form factor, KDZLV is suitable for automotive and industrial applications. Series... Read More

Sensors Monitors & Transducers

Six-Axis Combo Accelerometer-Gyro Sensors feature ULP design.

Aug 02, 2016

Respectively supplied in 3 x 3 x 0.9 mm, 16-pin LGA and 2.5x 3 x 0.9 mm, 14-pin LGA packages, KXG07 and KXG08 are 6-axis combo accelerometer-gyro sensors. Phase detection scheme enables full, high-speed operation of onboard accelerometer, gyroscope, and temperature sensor while consuming down to 0.2 mA. This allows always-on operation in motion sensing applications, including wearable devices... Read More

Electronic Components & Devices

Thin Compact LEDs are available in 15 colors.

Jul 05, 2016

Optimized for wearable tech, portable devices, and drones, PICOLED™ SML-P1 series comes in 1.0 x 0.6 mm package with 0.2 mm form factor made possible via combination of low gold wire loop and thin light emitting element. This low-profile, thin chip LED series, weighing 0.2 mg, also leverages element technology that eliminates wavelength variations. Furthermore, penetration... Read More

HVAC, Sensors Monitors & Transducers, Test & Measuring Instruments

Multi-Sensor Board aids sensor design/verification.

Jun 21, 2016

SENSORSHLD1-EVK-101 integrates 10 sensors: analog temperature, digital barometric pressure, Hall switch, magnetometer, digital accelerometer, digital magnetometer and accelerometer, digital gyroscope and accelerometer, analog UV, digital ambient light and proximity, and digital color. Also featured, Arduino interface pins ensure compatibility with existing open-source prototyping platforms... Read More

Electrical Equipment & Systems, Electronic Components & Devices

Low Power PMIC supports rechargeable battery applications.

May 24, 2016

Supplied in 4 x 4 x 0.62 mm WL-CSP, Model BD71815GW integrates 5 low-Iq buck regulators, 7 LDOs, JEITA-compliant 1S charger, fuel gauge with Coulomb Counter, LED driver, RTC, and extensive monitoring and protection circuits, helping users realize power efficiency of NXP’s i.MX 7D/S processors by supporting all possible power modes. Switching regulators deliver 82–92% efficiency across load... Read More

Communication Systems & Equipment, Electrical Equipment & Systems

Wireless Communication Module is Bluetooth SMART compatible.

Mar 01, 2016

Featuring Bluetooth® SIG certification, MK71050-03 integrates LAPIS Semiconductor's ML7105 wireless communication IC with 16 kB EEPROM, 26 MHz XO for master clock, and pattern antenna. Connection with host MCU is made via SPI, while commands and data format unique to LAPIS Semiconductor are implemented using 3 dedicated terminals: IRQ pin, WAKEUP pin, RF Active pin. Design has FCC... Read More

Electrical Equipment & Systems, Electronic Components & Devices

Low-Power Optimized PMICs support Skylake core processor.

Jan 19, 2016

Respectively available in 4.26 x 4.26 x 0.62 mm and 5.90 x 5.90 x 0.62 mm packages with 0.4 mm pitch, BD99991GW and BD99992GW enable fanless designs of such space-conscious mobile PC products as Ultrabooks™, 2-in-1 detachables, and tablets built around Intel® 14 nm Skylake CPU. BD99991GW supports core power rails required by the Skylake platform and Intel IMVP8 power management... Read More

Electrical Equipment & Systems

SiC Power Module supports high-power applications.

Dec 03, 2015

Integrating SiC SBD and SiC-MOSFET into single package, 1,200 V/300 A Model BSM300D12P2E001 is designed for inverters and converters in solar power conditioners and industrial equipment. Device features optimized chip layout and module construction that minimizes internal inductance, suppressing surge voltage while supporting operation up to 300 A. Switching loss is 77% lower than conventional... Read More

Electrical Equipment & Systems, Electronic Components & Devices, Optics & Photonics

CXPI-Compatible Transceiver IC promotes vehicle fuel efficacy.

Nov 11, 2015

Enabling responsive multiplex communication even in HMI systems, BD41000FJ-C supports CXPI next-generation vehicle communication protocol for reduced size and count of requisite wire harnesses. IC enables multiplexing between ECUs and fosters reliability in severe automotive environments. Quiescent current of 3 µA typ and ESD resistance of ±8 kV (IEC61000-4-2) make it possible to achieve... Read More

Controls & Controllers, Electronic Components & Devices

USB Type-C Power Delivery Controller ICs drive high-power devices.

Sep 24, 2015

Supporting conventional USB power supply modes up to 7.5 W (5 V @ 1.5 A) as well as power levels up to 100 W (20 V @ 5 A) for USB Type-C connected devices, BM92TxxMWV makes it possible to drive such equipment as PCs, monitors, docking stations, and peripherals via USB and accelerates charging of such compatible USB-equipped portable devices as smartphones and tablets. DisplayPort™... Read More

Electrical Equipment & Systems, Electronic Components & Devices

Li-Ion Battery Monitoring LSI is designed for compact equipment.

Aug 11, 2015

Supplied in 9 x 9 mm package, ML5233 offers overcharge detection accuracy of ±15 mV per each cell. This 10-cell li-ion battery monitoring LSI, which consumes 25 µA typ and 0.1 µA typ during power down, is suited for battery protection systems in portable equipment. Along with temperature and short-circuit current detection circuits, multiple abnormality detection and protection... Read More

Communication Systems & Equipment, Electronic Components & Devices

Compact Bluetooth Module enhances health, fitness devices.

Jul 21, 2015

Supplied in 52-pin, 10.7 x 13.6 x 1.78 mm package, MK71050-03 integrates EEPROM for program storage, crystal oscillator for system clock, and pattern antenna. Level of integration eliminates need for circuit adjustments for wireless communication. In addition to being certified to comply with all applicable radio laws and regulations in Japan, North America, and Europe, this Bluetooth... Read More

Electrical Equipment & Systems, Electronic Components & Devices

AC/DC Converter Control IC drives SiC MOSFETs.

Jun 30, 2015

Designed specifically for SiC MOSFET drive in industrial equipment such as servers and other large power applications, Model BD7682FJ-LB includes multiple protection functions that enable support for voltages up to 690 Vac. Device integrates gate drive circuit as well as quasi-resonant system that delivers lower noise and higher efficiency versus conventional PWM methods. With support for 120 kHz... Read More

Electrical Equipment & Systems, Electronic Components & Devices

Power Modules suit motor driving and inverter applications.

Jun 16, 2015

Rated at 600 V, IPM Intelligent Power Modules integrate gate drivers, bootstrap diodes, IGBTs or power MOSFETs, as well as fly wheel diode within single package. Units offer range of currents, including 1.5, 2.5, 10, 15, 20, and 30 A. Featuring aluminium-based Silicon-on-insulator technology, ICs include current limit for bootstrap diode, under voltage lock-out for floating supply, fault... Read More

Electronic Components & Devices

SiC MOSFET minimizes equipment size and power consumption.

Jun 09, 2015

Adopting trench structure, SiC MOSFET (Metal Oxide Semiconductor Field Effect Transistor) offers ON resistance that decreases power loss in equipment ranging from industrial inverters and power supplies to power conditioners for solar power systems. Full SiC power module (1,200 V/180 A), incorporating trench-type SiC MOSFETs in a 2-in-1 circuit with integrated SiC SBDs, is also available. Read More

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ROHM Semiconductor USA, LLC