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Epoxy Adhesive suits microelectronic assembly applications.
Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90Ã-
Read More »Epoxy Adhesive suits microelectronic assembly applications.
Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90Ã-
Read More »