Press Release Summary:
Suited for handheld communication and entertainment applications, LOCTITE UF3810 delivers drop and shock protection and thermal cycling reliability for fine-pitch (0.5 mm and below) area array devices. Material is halogen-free, completely reworkable, and has glass transition (Tg) temperature of 100Â°C, delivering thermal cycling reliability for next-generation wafer-level CSP (WLCSP) and PoP devices. Product underfills at room temperature and cures at 130Â°C.
Original Press Release:
High Tg, Reworkable Underfill from Henkel Ideal for High Value, Fine-Pitch Area Array Devices
Expanding on its portfolio of advanced underfill materials, Henkel has developed LOCTITE UF3810, a new underfill technology that provides extremely high reliability while also allowing for easier reworkability as compared to previous generation products.
Designed to deliver superior performance and ease-of-use, LOCTITE UF3810 addresses many of the complex requirements associated with today's high value devices, but does so in a formulation that has excellent processability. The material is halogen-free, completely reworkable and has a high glass transition (Tg) temperature of 100°C, thereby delivering robust thermal cycling reliability for next-generation wafer-level CSP (WLCSP) and PoP devices.
As Dr. Brian Toleno, Henkel's Global Product Manager for Liquids, explains, LOCTITE UF3810 is the go-to product for manufacturers seeking high reliability in a cost-conscious formulation. "With increasing device complexity comes increasing cost," says Toleno. "Assembly specialists want to reliably protect these devices but also have the option to rework them should any issues arise. LOCTITE UF3810 provides high reliability and reworkability - a balance not readily available with traditional, low Tg formulas."
Ideally suited for today's handheld communication and entertainment applications, LOCTITE UF3810 delivers excellent drop and shock protection and improved thermal cycling reliability for fine-pitch ( 0.5mm pitch and below) area array devices. In addition to superior performance versus alternative reworkable underfills, LOCTITE UF3810 also provides ease-of-use that lends to its process flexibility. The material flows fast and underfills at room temperature and cures quickly at a moderate 130°C which, in addition to its halogen-free status, adds to the material's sustainability through reduced energy consumption requirements. These characteristics, in combination with its proven solder compatibility, make LOCTITE UF3810 a highly versatile, yet highly effective underfill system.
"This material's value has already been proven in the handheld market," concludes Toleno. "But LOCTITE UF3810 has also attracted the attention of those in the defense/aerospace and automotive sectors, as it allows incorporation of CSP and PoP devices without any adverse impact to reliability. For anyone seeking a highly reliable underfill system that allows cost-conscious reworkability, LOCTITE UF3810 is the obvious solution."
For more information on LOCTITE UF3810 or any of Henkel's next-generation underfills, log onto www.henkel.com/electronics or call the company headquarters at 714-368-8000.
Henkel operates worldwide with leading brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 48,000 people and reported sales of 15,092 million euros and adjusted operating profit of 1,862 million euros in fiscal 2010. Henkel's preferred shares are listed in the German stock index DAX and the company ranks among the Fortune Global 500.