Wafers

Molecular Imprints, Inc. (MII) Delivers Industry's First 450mm Advanced Lithography System to a Leading Semiconductor Manufacturer in Support of the Global 450mm Initiative
Semiconductor Processing Equipment

Molecular Imprints, Inc. (MII) Delivers Industry's First 450mm Advanced Lithography System to a Leading Semiconductor Manufacturer in Support of the Global 450mm Initiative

MII's J-FIL(TM) Technology Accelerating the Semiconductor Industry's Adoption to 450mm Manufacturing by 2 Years AUSTIN, Texas- Molecular Imprints, Inc., a technology leader in advanced semiconductor lithography, today announced the delivery of the first advanced lithography platform capable of patterning 450mm silicon wafer substrates. The Imprio(®) 450, was accepted by a leading...

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Solar Panels

ReneSola's High-Wattage Solar Module Passes TUV SUD's PID Test

FRANKFURT, Germany - ReneSola Ltd ( ReneSola" or the "Company") (NYSE: SOL), a leading global manufacturer of solar photovoltaic ("PV") modules and wafers, today announced its 300 watt ("W") multicrystalline solar module has passed the potential-induced degradation ("PID") test performed by TUV SUD, a leading provider of testing, inspection and certification solutions. The PID test was conducted...

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Transistors

Soitec Outlines Fully Depleted Product Roadmap for Advanced Planar and Three-Dimensional Transistors

Product offer designed to enable continued advances in performance and efficiency of mainstream mobile consumer devices BERNIN, France and PEABODY, Massachusetts - Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, announced today its fully depleted (FD) product roadmap comprising two products designed for both...

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Wafers

STMicroelectronics Produces World's First Wafer Employing Fully Contactless Testing

GENEVA -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the successful production of the world's first semiconductor wafer whose dice were fully tested without contact probes. ST's innovative advance in testing technology enables a wafer containing chips such as RFID (Radio Frequency Identification)...

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Photovoltaic Equipment

ReneSola Rolls Out Shipments of Its New Multicrystalline Virtus Wafer and Module Lines

Company ships 54.8 MW of Virtus wafers and 20 MW of Virtus modules in June 2011 Achieves 900 MW of annual Virtus wafer production capacity JIASHAN, China - ReneSola Ltd ("ReneSola" or the "Company") (NYSE: SOL), a leading global manufacturer of solar products, today announced that it began shipments of its Virtus wafers and modules in June, shipping an aggregate total of approximately 54.8...

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Imec Processes First Power Devices on 200mm CMOS-compatible GaN-on-Si
Semiconductors

Imec Processes First Power Devices on 200mm CMOS-compatible GaN-on-Si

LEUVEN, BELGIUM - Imec and its partners in the GaN industrial affiliation program (IIAP) have produced device-quality wafers with GaN/AlGaN layers on 200mm silicon wafers. With these wafers, functional GaN MISHEMTs were processed using standard CMOS tools. The used processes are compatible with the strict contamination rules in a standard CMOS processing line (e.g. no use of gold). These first...

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Electronic Chips

Chip Technology uses pulsed light for communications.

Incorporating electrical and optical devices on same piece of silicon, CMOS Integrated Silicon Nanophotonics increases computer chip performance by using light pulses for communication. This technology can be produced on front-end of standard CMOS manufacturing line and will increase speed and performance between chips. Density of optical and electrical integration allows single transceiver...

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Process Allows Nanoscale MEMS to be created inside CMOS wafer.
Miscellaneous Fabrication Services

Process Allows Nanoscale MEMS to be created inside CMOS wafer.

NanoEMS(TM) technology enables construction of nanoscale MEMS (Micro Electro Mechanical Systems) within structure of actual CMOS wafer itself using standard, high-volume CMOS lines. Existing metal layers in CMOS wafer are used to form MEMS structure via standard mask techniques, and Inter Metal Dielectric is etched away using vapour HF. Etching uses equipment already available for volume...

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Industry-Specific Solutions from Montech
Belt Conveyors

Industry-Specific Solutions from Montech

Derendingen (29/07/2009) At the EU Photovoltaic show in Hamburg, the Swiss company Montech AG is introducing specific solutions for the transport and handling of wafers, cells and carriers. Wafer belt conveyors, discharge belts, conveyors with lifting units, vacuum belts, waste extraction belts, process belts and centering belts will be under the spotlight in Stand 29 in Hall B1G. The key benefit...

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Neagle Choice, LLC Announces New Available Services
Sponsored

Neagle Choice, LLC Announces New Available Services

Neagle Choice has long been known as a quality source for commercial sewing, printing, die cutting, and the manufacturing of a wide range of custom products. Enhancing our service capabilities has been the key to our success, and has driven our growth into many new and exciting markets. Continuing on this trajectory, we now offer precision laser cutting and etching, adding to our long line of manufacturing services. See our video to learn all about it.

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