New VEML3328 and VEML3328SL RGBC-IR Color Sensors Offer Better Linearity and Higher Sensitivity
Features low operating voltage range of 2.6 V to 3.6 V and can sense red, green, blue, clear, and IR light. Built-in ambient light photodiode that offers high sensitivity, allowing the devices to operate in applications with dark lens designs. Ideal for applications such as automatic white balancing and color cast correction in digital cameras; automatic LCD backlight adjustment; and active...
Read More »New 3D Image Sensor Measures 4.4 x 5.1 mm in Size
REAL3™ chip allows it to be incorporated into small devices with just few elements. Provides high resolution data with low power consumption. Meets a range of applications in the areas of security, image use and context-based interaction with the devices.
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New Image Sensor and Wafer-level Camera Module Features Small Pixel Size of 2.2 Microns
OC0VA wafer-level camera module combines sensor with image signal processing and optics into a 2.69 x 3.04 x 3.04mm. OG0VA image sensor has a small form factor that results in a 2.69x3.04mm footprint for the OC0VA camera module. Provides 640x480 VGA resolution at 240 fps and 320x240 QVGA resolution at 480 fps.
Read More »New Image Sensors Offer 3840 x 2160 Resolutions at 36fps and 16:9 Display Aspect Ratio
OX08A and OX08B utilizes dual conversion gain technology to achieve 82dB dynamic range on the first exposure. Provides 140dB HDR along with LFM performance and high 8MP resolution for front-view captures, regardless of external lighting conditions. Includes region-of-interest functionality for clear images of moving objects within fixed areas in the camera's field of view.
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3-Ways Outsourced HR Teams Elevate Employee Performance & Decrease Costs
Is outsourcing your HR department the right call for your company? This white paper explores various factors for you to consider.
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New colorSENSOR CFO100 Color Sensor Can Detect Semi-Transparent Glass Bottles
Used for position detection in automated printing processes of cosmetics bottles. Detects this minimal color difference, which enables the exact determination of the printing position below the embossment. Offer outputs in OK / NOK signal within the specified cycle time of less than two seconds.
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New Color CFO200 Sensors Designed for High Precision Color Measurements
Operated at a measurement frequency of up to 30 kHz. Recognizes any color as well as minimum color differences whether it’s for quality control, painting technology, automation systems, medical packaging, surface-labelling and printing technology tasks. Features extended and optimized command set for REST-API and the RS232 log.
Read More »New OV12D Image Sensor Ideal for Front-facing Selfie Cameras
Features large 1/2.4" optical format, on-chip 4-cell remosaic color filter, PDAF and extra pixels for 4K2K video EIS. Can output an 3MP/1080p resolution with 20% additional pixels for EIS video and images at four times the sensitivity. Supports CPHY and DPHY interfaces and can output 12MP 16:9 captures at 60fps, 4K video at 60fps and 1080p video at 240fps.
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Critical Link to Debut Canon Evaluation Kits at MD&M Minneapolis Expo
Syracuse, N. Y. – September 18, 2019 – Critical Link, a leading provider of electronics and engineering services for industrial embedded applications, will present its latest sensor evaluation kits and board level solutions at Medical Design & Manufacturing (MD&M), Minneapolis, October 23 - 24, 2019. The company will premiere its new evaluation kits that feature Canon’s latest line of...
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New TekLink TL2000PS Image Sensors from Kenall are Ideal for Parking Facilities
Integrated in TekDek TD17 and SenScape SPG18 parking luminaires. Features facility owners save over the cost of adding these systems individually. Offers car counting technology to parking facilities and can provide car counting data to parking facilities' message boards as vehicle enters the garage.
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New ARX3A0 Digital Image Sensor with 0.3 Mega-pixel Resolution in 1:1 Aspect Ratio
Designed to deliver flexible, high-performance image capture with minimal power. Consumes less than 19 mW when capturing images at 30 fps and 2.5 mW when capturing 1 fps. Suitable for emerging machine vision, artificial intelligence and AR/VR applications.
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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