Thermoelectric Coolers

Thermoelectric Coolers

Laird Technologies Adds Thermoelectric Assembly Product Line to Digi-Key's Product Training Modules® Series

Training Module Provides Overview of TEA Product Line and Analyzes Heat Transfer Mechanism St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it has added its Thermoelectric Assembly (TEA) product line to Digi-Key's Product Training...

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Thermoelectric Coolers

Thermoelectric Cooling Assemblies feature cross flow technology.

Suited for cooling applications with tight geometric space constraints, Tunnel Series maximizes heat transfer when pulling air through heat exchanger. Heat is absorbed and dissipated through high-density heat sink equipped with metal shrouds and fans. Air-Air Models AA-027-12-22 and AA-035-24-22 utilize convection cooling method, while Direct-Air Models DA-033-12-02 and DA-039-12-02 utilize...

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Thermoelectric Coolers

Thermoelectric Assemblies increase cooling in enclosures.

Suited for telecom battery back-up systems and electronic integration enclosures in harsh environments, AA-100/-150/-200 Air-to-Air Outdoor Thermoelectric Cooler Assemblies feature solid-state operation and do not use compressor or CFC refrigerants. Elements of construction include waterproof connectors, high-density heat sinks with heavy-duty anodization, and overheat protection as well as...

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Thermoelectric Coolers

Nextreme and Voxtel Announce the World's First OptoCooler Equipped Avalanche Photodiode

Thin-film thermoelectric device cools photon detector in a small package for improved efficiency, performance and reliability... DURHAM, N.C. (October 29, 2008) - Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced that Voxtel, Inc., a leading developer of sophisticated detectors and electrooptical imaging...

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