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Thermal Management Materials

Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts

(December 19, 2007) -- Amphenol Total Connection Solutions (TCS) used Flomerics' Flotherm software to overcome the thermal management challenges of a 14 rack unit (U) chassis dissipating 1700 watts. Amphenol engineer Chris Heard simulated the product, which includes a total of fourteen 100-watt and two 150-watt printed circuit boards (PCBs). This project demonstrates how thermal simulation can be...

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Phase Change Material is available as liquid product.

Suited for lidded and bare die processor applications, PowerstrateXtreme(TM) Dispensable (PSX-D) is phase change material offered as paste medium, enabling application thickness to be adjusted. Once compound is applied, it cures and dries to solid phase change material, and when heated to phase change temperature, material flows and conforms to surface irregularities of heat sink and component....

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Nanostructured Thin Film TEG(TM) Harvests and Converts Waste Heat into Electricity

Nextreme's miniature thin film TEG(TM) enables recycling of heat to electricity... Research Triangle Park, N.C. (August 15, 2007) - Nextreme has developed a miniature, thin film thermoelectric generator (TEG(TM)) that converts heat directly into electricity. Ideal for waste heat conversion applications, the solid state TEG delivers power generation densities (>3W/cm2) in excess of those achieved...

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Varian 3800 Replacement Thermal Conductivity Detectors

Varian 3800 Replacement Thermal Conductivity Detectors

Bethlehem, PA - July 2007 - GOW-MAC-® Instrument Co. provides replacement thermal conductivity detectors (TCDs) for the Varian 3800 gas chromatograph (GC), as well as for the obsolete Varian 3400, 3600, and 3700 GCs. Each detector meets original equipment specifications and comes ready to install in your existing Varian GC. The detector is made of stainless steel and comes with rhenium-tungsten...

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Pfannenberg Inc. Introduces Redesigned Global Pfannenberg Sizing Software (GPSS) Tool

Pfannenberg USA introduces their free Global Pfannenberg Sizing Software (GPSS) tool, downloadable directly from the Pfannenberg USA website (www.pfannenbergUSA.com). This advanced sizing tool helps the user configure Filterfans, Cooling Units, A/W HE and Heaters for electrical enclosures. To achieve proper sizing for effective thermal management, the Global Pfannenberg Sizing Software tool works...

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Andigilog® Adds Two New Thermal Management Solutions for PCs and Servers, Including Support for Intel Platform Environmental Control Interface (PECI) Interface

Andigilog aSC7621 and aSC7611 Thermal Management System Controllers Integrate Fan Control with High Accuracy Temperature Sensing for Better System Performance TAIPEI, Taiwan--Andigilog-®, the fabless semiconductor company providing intelligent thermal management solutions, today announced the aSC7621 and the aSC7611 thermal management system controllers with integrated fan control. Both devices...

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American Power Conversion's New Thermal Guarantee(TM) Equipment Protection Program Offers $150,000 of Security Against Hardware Damage from Thermal Events

APC's Thermal Certification Increases Reliability and Peace of Mind for Blade Server and Other High Density Installations WEST KINGSTON, R.I., Dec. 18 -- American Power Conversion (NASDAQ:APCC) (APC), a global leader in power, cooling, and management solutions, today announced its Thermal Guarantee Equipment Protection program that provides financial compensation for properly protected and...

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Thermal Gap Filler cools and protects hot PCB components.

Thermal Gap Filler cools and protects hot PCB components.

With 10 Shore 00 hardness, Softtherm-® 86/200 can blanket over multiple components of differing height, contours, and planarity. It features elastic, structurally secure silicone filled with ceramic particles. Product retains its memory after compression, enabling it to be reused. Thermal resistance is 1.50 K/W, and thermal conductivity is 1.0 W/mK. Available in die-cut shapes and in sheet form...

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sp³ Diamond Technologies Forms Strategic Partnership with Ceramics Process Systems

SANTA CLARA, CA - sp-³ Diamond Technologies, Inc. (sp-³), a supplier of DiaTherm(TM) diamond heat spreaders and diamond products for solving thermal management challenges in high-performance applications, announces a strategic partnership with Ceramics Process Systems (CPS), a developer and manufacturer of Aluminum Silicon Carbide (AlSiC) thermal management and packaging solutions. Geared...

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Metal Matrix Composite enhances thermal performance.

Metal Matrix Composite enhances thermal performance.

AlSiC features high stiffness to low density ratio, making it structurally suited for large parts with thin cross sections while enabling incorporation of thermal management features such as pin fins. Pins are cast during AlSiC pressure infiltration process and are targeted for microprocessor lids or liquid cooled IGBT base plates. Tailored, isotropic coefficient of thermal expansion provides...

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