Thermal Management Materials

New Type of Paste with Enhanced Thermal Conductivity for Modules - TIM Allows Higher Power Density for Same Ageing Resistance

New Type of Paste with Enhanced Thermal Conductivity for Modules - TIM Allows Higher Power Density for Same Ageing Resistance

New Type of Paste with Enhanced Thermal Conductivity for Modules – TIM Allows Higher Power Density for Same Ageing Resistance Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today's power semiconductors must be integrated as early as their design phase. Only then can reliable cooling be safeguarded over the long term. A...

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Laird Technologies and Nextreme Thermal Solutions Announce World-Wide Strategic Distribution and Design Partnership

Nextreme's Products Expand Laird Technologies' Thermal Management Portfolio St. Louis, Missouri and Durham, North Carolina, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, and Nextreme Thermal Solutions, the leader in micro-scale thermal management and power...

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Laird Technologies to Attend Automotive Electronics Conference 2011

Company to Focus on Solutions for Automotive Electronics Segment in India St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the Automotive Electronics Conference (AEC) 2011. The conference will be held at the...

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Thermacore Leads Largest Collaborative Nanotechnology Project

Lancaster, PA - Thermacore, Inc. (www.thermacore.com), a leading provider of heat pipe technology and other thermal management solutions, announced today that Thermacore Europe is making tremendous progress as lead partner of an Euros8.3 million ($11.4M) European research project, NanoHex. The team is tasked with developing a next-generation liquid coolant that incorporates purpose engineered...

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Henkel to Show Latest Materials Innovations at APEX 2010

Henkel to Show Latest Materials Innovations at APEX 2010

Irvine, California - Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment - even throughout the recent downturn - has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources...

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Watlow Now Offers Custom Version of TLM-8 Thermal Limit Monitor

Watlow Now Offers Custom Version of TLM-8 Thermal Limit Monitor

Feb. 6, 2008 St. Louis, MO - Watlow, a leading designer and manufacturer of heaters, controllers and temperature sensors, is now offering a custom version of its TLM-8 thermal limit monitor. This new custom version supports applications that have a need for higher accuracy temperature limits or specific limit settings not otherwise available. This new version of the TLM-8 is a perfect fit for...

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IMS Introduces New B-Series Therma-Bridge, Thermal Management Device

IMS Introduces New B-Series Therma-Bridge, Thermal Management Device

For Release February 5, 2008 Portsmouth, Rhode Island, USA- International Manufacturing Services, Inc. (IMS) introduces the B-Series Therma-Bridge as a simple and cost effective thermal management device. The B-Series Therma-Bridge uses a thermally-conductive Aluminum Nitride chip with metalized terminals to transport heat from one location to another, thus enhancing overall board performance....

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Pfannenberg Inc. Introduces Redesigned Global Pfannenberg Sizing Software (GPSS) Tool

Pfannenberg USA introduces their free Global Pfannenberg Sizing Software (GPSS) tool, downloadable directly from the Pfannenberg USA website (www.pfannenbergUSA.com). This advanced sizing tool helps the user configure Filterfans, Cooling Units, A/W HE and Heaters for electrical enclosures. To achieve proper sizing for effective thermal management, the Global Pfannenberg Sizing Software tool works...

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Thermal Gap Filler cools and protects hot PCB components.

Thermal Gap Filler cools and protects hot PCB components.

With 10 Shore 00 hardness, SoftthermÂ-® 86/200 can blanket over multiple components of differing height, contours, and planarity. It features elastic, structurally secure silicone filled with ceramic particles. Product retains its memory after compression, enabling it to be reused. Thermal resistance is 1.50 K/W, and thermal conductivity is 1.0 W/mK. Available in die-cut shapes and in sheet...

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sp-³ Diamond Technologies Forms Strategic Partnership with Ceramics Process Systems

SANTA CLARA, CA - spÂ-³ Diamond Technologies, Inc. (spÂ-³), a supplier of DiaTherm(TM) diamond heat spreaders and diamond products for solving thermal management challenges in high-performance applications, announces a strategic partnership with Ceramics Process Systems (CPS), a developer and manufacturer of Aluminum Silicon Carbide (AlSiC) thermal management and packaging solutions....

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How SpinSelect Can Save You Time and Money
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How SpinSelect Can Save You Time and Money

Thanks to the unique SpinSelect™ Multi-Pocket selectable quick change tool holder, it's time to rethink the range, complexity and volume of parts that your lathe can produce. Our Spin-Select™ tool was created to increase productivity and consistency by decreasing downtime associated with lathe cutting tool and insert setups or changeovers. This product is a game-changer for the industry and we're pleased to show you why.

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