Thermal Interface Materials

Miscellaneous Film

Henkel's Novel Thermal Absorbent Film Wins Prestigious Industry Prize

Loctite TAF-8800 Thermal Absorbent Film Material Honored with Global Technology Award At last week’s Productronica event in Munich, Germany, The Electronics Group of Henkel was presented with a Global Technology Award for its new thermal absorbent film material, Loctite TAF-8800. In the category of Adhesives/Encapsulants/Underfills, Loctite TAF-8800 was judged to be the most innovative...

Read More »
Coatings

Electrolube's Thermal Products for LEDs a Resounding Success at Productronica India

Electrolube, the leading manufacturer of high performance electro-chemicals for the electronics, automotive and industrial manufacturing industries, has reported an overwhelming response from visitors at Productronica India to the company's new thermal management products for LED production. The specialist chemicals manufacturer returned from the show with an impressive enquiry list from new...

Read More »
Thermal Interface Materials

Phase Change Materials provide stability within 5° range.

In addition to transport of temperature sensitive products, savENRG Phase Change Materials are suitable for use in cooling of electronics, heat sinks, and thermal energy storage for solar water heating. HS10N, OM32P, OM35P, OM48P, and OM65P will provide temperature stability within 5° range of -10°C/14°F, 32°C/90°F, 35°C/95°F, 48°C/118°F, and...

Read More »
Miscellaneous Compounds

Thermal Pads increase LED lamp/luminaire performance.

Dispensable Thermal Pads enable LED lamp and luminaire manufacturers to print layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes while ensuring optimal thermal management properties. Applied via standard screen or stencil print processes or standard dispensing equipment, materials conform to complex/unevenly shaped substrates and cure in place....

Read More »
High Quality Potting Compound Meets Special Criteria
Miscellaneous Compounds

High Quality Potting Compound Meets Special Criteria

CRANSTON, RI USAÂ- – 50-1952, by Epoxies, Etc., is a Thermally Conductive Silicone Potting and Encapsulating Compound with outstanding properties over a broad temperature range.  Many electrical potting applications require the material transfer heat well, have good electrical properties and protect components.  The 50-1952 meets these criteria and stands out in several...

Read More »
Silicon

Dispensable Thermal Pads target LED lighting applications.

With Dispensable Thermal Pads, LED luminaire manufacturers can print layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes while ensuring optimal thermal management. TC-4015 and TC-4016 offer thermal conductivity of 1.5 W/mK, while TC-4025 and TC-4026 offer thermal conductivity of 2.5 W/mK. Incorporating glass beads, TC-4016 and TC-4026 enable...

Read More »
Thermal Interface Materials

TIM Characterization Tools come in various sizes, package types.

Thermal Interface Material (TIM) characterization tools comprise Thermal Test Chips (TTCs) in sizes from 2.5–12.8 mmÂ-² mounted on various packages, including BGA, QFN, and DIP. These tools, which include TTV-1100/1200/1500/1800/3000/3100 Series, can also be used to simulate heat sources for validation of thermal simulation, quantify thermal management performance, and establish...

Read More »
MacDermid's XtraForm Takes FIM to Another Level
Miscellaneous Film

MacDermid's XtraForm Takes FIM to Another Level

MacDermid Autotype's XtraForm™ has provided the perfect film for moldings on deep sea diving equipment for Italian manufacturer Mares. The success of this film insert molding solution underlines the excellent durability of XtraForm even in extreme conditions. Mares is a worldwide leader in the manufacturing and distribution of high-tech diving equipment, and its local moulding supplier, Mold &...

Read More »
New Type of Paste with Enhanced Thermal Conductivity for Modules - TIM Allows Higher Power Density for Same Ageing Resistance
Modules

New Type of Paste with Enhanced Thermal Conductivity for Modules - TIM Allows Higher Power Density for Same Ageing Resistance

New Type of Paste with Enhanced Thermal Conductivity for Modules – TIM Allows Higher Power Density for Same Ageing Resistance Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today's power semiconductors must be integrated as early as their design phase. Only then can reliable cooling be safeguarded over the long term. A...

Read More »

All Topics