Thermal Interface Materials

Thermal Compound supports form-in-place gap filling.
Miscellaneous Compounds

Thermal Compound supports form-in-place gap filling.

Capable of filling large gaps around fragile circuit board solder points without causing damage or loss in performance, 5.0 W/m°K SARCON® SPG-50A facilitates efficient transfer of heat from any board-level source to nearby heat sink or heat spreader. Silicon based material provides optimized vibration absorption capabilities and maintains all initial properties across wide temperature...

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ZKW Group and DSM Develop New Light Weight LED Lighting Module for Audi Q7
Lamp Parts

ZKW Group and DSM Develop New Light Weight LED Lighting Module for Audi Q7

Royal DSM, the global Life Sciences and Material Sciences company, announces the use of Arnite® XL-T in the new Audi Q7 for automotive headlight applications that can resist extreme thermal loads. Headlights are a key distinguishing feature for a car's identity and currently LED lighting, with its excellent performance characteristics, is the cutting edge of automotive headlamp design. They...

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Cooling for LEDs
Thermal Interface Materials

Cooling for LEDs

Cooling for LEDsÂ-  Carteret, NJ — LED lighting has made a profound impact on the functionality and appearance of millions of consumer and commercial products. One of the most challenging issues when using LEDs is thermal dissipation. These lighting packages typically generate a significant amount of heat. If it is not managed correctly, this can severely limit the efficiency, output and...

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Thermal Interface Material offers EMI absorption.
Thermal Interface Materials

Thermal Interface Material offers EMI absorption.

With thermal conductivity of 1.0 W/m-K and EMI absorption for frequencies above 1 GHz, GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in flexible, gap filling product designed to exhibit exceptionally low stress on solder joints. Thermal conductivity is optimized by material’s natural tack on one side, which eliminates requirement for any...

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Thermal Interface Materials optimize electronics' design.
Thermal Interface Materials

Thermal Interface Materials optimize electronics' design.

Formulated to support application requirements, Aavid SuperThermal™ offers high thermal conductivity up to 13.2 W/mK. Aavid SoftFlex™ includes 5 materials varying in elasticity, conductivity, cushioning ability, and compliancy. Softness and compressibility makes product suitable for decreasing board strain and for applications with shock or vibration. Aavid WaveBlocker™ gap filler,...

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Low-Profile Heatsinks enhance space-constrained designs.
Heat Sinks

Low-Profile Heatsinks enhance space-constrained designs.

Optimized for deployment in streamlined, high-density electronic designs, LPH00xx series utilizes VersarienCu™ microporous copper technology and offers form factors that cover 10 x 10 x 2 mm through 40 x 40 x 5 mm. Microporous structure maximizes surface area and optimizes heat dissipation in space constrained designs. For applied load of 5 W,Â- thermal resistance of 40 x 40 x 5 mm...

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ECU and Embedded Systems Cooling
Modules

ECU and Embedded Systems Cooling

Carteret, NJ — Electronic Control Units (ECUs) are the brains of modern vehicles. As engineers push the limits of performance, safety and passenger comfort they can pack nearly 100 embedded systems into a single, mobile platform. To maintain optimum performance, all ECU processors must be kept cool and within strict operational temperatures. Fujipoly® offers one of the industry's most...

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AEM Pre-Compound extends temperature limit in auto applications.
Compounds

AEM Pre-Compound extends temperature limit in auto applications.

With heat resistance and long-term static heat aging characteristics, DuPont™ Vamac® VMX5000 ethylene acrylic elastomer (AEM) pre-compounds offer alternative to fluoroelastomers (FKM) inÂ- 160 to 190°C range for automotive hoses and seals required by such trends as high-pressure turbo charging and exhaust gas recirculation. Pre-compounds additionally exhibit acid and...

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Foils

Thermal Foil Sheets increase electronics deign flexibility.

Intended for use beneath screens in such applications as tablets, laptops, and flat screen TVs, thermal foil productsÂ- conduct heat away from internal electronic components and batteries to help maximize performance. Thicknesses from 5–40 µm with thermal conductivity ratings from 800–1,700 W/m-K increase design flexibility for manufacturers. Also suitable for EMI shielding,...

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